Xilinx XCKU060-1FFVA1517I

Part points

• The XCKU060-1FFVA1517I chip is a field-programmable gate array (fpga) from xilinx's kintex ultrascale+ family. it offers high capacity and performance with advanced features suitable for various applications. with a wide range of programmable logic resources, efficient signal processing capabilities, and integrated peripherals, this chip allows for flexible design and development of advanced hardware systems.

• Equivalent

  The equivalent products of the XCKU060-1FFVA1517I chip are the xcku060-vfbc1156e and xcku060-ffvb1156e chips.

• Features

  The XCKU060-1FFVA1517I is a field programmable gate array (fpga) with 415,000 logic cells, 1,165,000 configurable flip-flops, and 2,856,000 internal logic registers. it operates at a maximum speed of 1.2 ghz and supports various i/o standards, including lvcmos, lvttl, and differential signaling. it also offers built-in high-speed transceivers and integrated memory blocks.

• Pinout

  The XCKU060-1FFVA1517I has 1,517 pins and is a field-programmable gate array (fpga) device. the specific pin functions vary depending on the configuration and usage of the device, but it typically includes a mix of power and ground pins, i/o pins for logic signals, clock source pins, and configuration pins for programming the device.

• Manufacturer

  The manufacturer of the XCKU060-1FFVA1517I is xilinx inc. it is an american technology company that specializes in the development and manufacturing of programmable logic devices and associated software tools. xilinx is widely recognized for its field-programmable gate array (fpga) and programmable system-on-chip (soc) solutions.

• Application Field

  The XCKU060-1FFVA1517I is a field-programmable gate array (fpga) that can be used in various application areas including telecommunications, aerospace and defense, automotive, and industrial. it is particularly suitable for high-performance computing, data center acceleration, and signal processing applications due to its advanced features and capabilities.

• Package

  The XCKU060-1FFVA1517I chip has a package type of flip-chip, a form of bga (ball grid array), and a size of 1517 fcbga (flip chip ball grid array).