Xilinx XCKU035-2FBVA900I

Part points

• The XCKU035-2FBVA900I chip is part of Xilinx's Kintex UltraScale+ family, offering high performance FPGA capabilities. It features 35,200 logic cells, 2.9 million system logic cells, and supports advanced technologies like high-bandwidth memory and error correction codes. With a focus on speed and efficiency, it is suitable for a variety of applications such as data centers, network acceleration, and wireless communications.

• Features

  The XCKU035-2FBVA900I is an FPGA device from Xilinx. It belongs to the Kintex UltraScale+ family and has a speed grade of -2. It has a capacity of 350,000 logic cells and includes various high-speed serial interfaces, including PCIe Gen3, 100 Gigabit Ethernet, and DDR4 memory interfaces.

• Pinout

  The XCKU035-2FBVA900I has a pin count of 900. It is an FPGA (Field-Programmable Gate Array) and does not have fixed functions for each pin, as the functionality can be programmed and customized by the user.

• Manufacturer

  The manufacturer of the XCKU035-2FBVA900I is Xilinx. Xilinx is an American technology company that specializes in the development and manufacturing of programmable logic devices and related software tools.

• Application Field

  The XCKU035-2FBVA900I is a high-performance field-programmable gate array (FPGA) widely used in the aerospace, defense, and scientific research fields. It finds application in radar systems, software-defined networking, high-performance computing, communication systems, and image and signal processing, among others.

• Package

  The XCKU035-2FBVA900I chip is available in the package type of Flip-Chip Ball Grid Array (FBGA). Its form is a rectangular shape with solder balls underneath. The size of the chip is approximately 13 mm by 13 mm.