Xilinx XC7S25-2CSGA225I

Part points

• The XC7S25-2CSGA225I is a Field Programmable Gate Array (FPGA) chip from Xilinx, designed for high-performance applications. It features 25,000 logic cells, 180 DSP slices, and 1.17 Mb of RAM. With a speed grade of -2, it offers fast processing speeds for demanding tasks. The chip comes in a 225-pin chip-scale ball grid array (CSGA) package for compact and efficient integration into electronic devices.

• Equivalent

  Some equivalent products of the XC7S25-2CSGA225I chip include XC7S25-1CSGA225I, XC7S25-2CSGA132I, and XC7S25-3CSGA225I. These chips belong to the Xilinx Spartan-7 family and have similar features and performance capabilities.

• Features

  XC7S25-2CSGA225I is a Xilinx Spartan-7 FPGA with 23,360 logic cells, 32 DSP slices, 160 KB of block RAM, and 100 configurable I/O. It operates at a speed grade of -2 and is housed in a CSGA225 package. This FPGA is suitable for a wide range of applications requiring moderate performance and low power consumption.

• Pinout

  The XC7S25-2CSGA225I is a Spartan-7 FPGA with a 225-pin Fine-Pitch Ball Grid Array (FPBGA) package. It has a total of 116 user I/O pins, including configurable I/O standards. The device is ideal for a wide range of applications that require high-speed processing and connectivity capabilities.

• Manufacturer

  The XC7S25-2CSGA225I is manufactured by Xilinx, Inc., which is an American technology company primarily known for its semiconductor products, particularly programmable logic devices. Xilinx specializes in field-programmable gate arrays (FPGAs) and other related technologies for use in a wide range of industries including automotive, telecommunications, data center, and industrial markets.

• Application Field

  The XC7S25-2CSGA225I is commonly used in aerospace and defense applications, industrial automation, medical devices, telecommunications, and automotive electronics. This FPGA is ideal for applications that require high-performance processing capabilities, low power consumption, and flexibility for design modifications.

• Package

  The XC7S25-2CSGA225I chip is in a Ball Grid Array (BGA) package with a size of 225 pins. It has a minimum order quantity of 1 and is available in tape and reel packaging.