Xilinx XC7S25-1CSGA324I

Part points

• The XC7S25-1CSGA324I is a Xilinx Spartan-7 FPGA with 25,000 logic cells, 1,620 Kb of block RAM, and 200 DSP slices. It comes in a 324-pin package and is ideal for applications requiring high-performance and low power consumption.

• Equivalent

  Some equivalent products of the XC7S25-1CSGA324I chip are Xilinx Artix-7 FPGA, Spartan-7 FPGA, and Kintex-7 FPGA. These chips offer similar capabilities and features for a wide range of applications, making them suitable alternatives to the XC7S25 chip.

• Features

  XC7S25-1CSGA324I is a Xilinx Spartan-7 FPGA in a 324-pin Advanced Packaging Technology (APT) package. It features 23,360 logic cells, 504 Kb Block RAM, and 30 DSP slices. It also includes 4 Clock Management Tiles, 90 I/O pins, and 16.4 Gbps transceivers. It operates on a supply voltage of 0.95V to 1.05V.

• Pinout

  The XC7S25-1CSGA324I has 324 pins and is a Spartan-7 FPGA with 25,000 logic cells. It is used for general purpose applications such as industrial automation, automotive, and consumer electronics. The device offers high-performance processing, DSP capabilities, and low power consumption.

• Manufacturer

  The XC7S25-1CSGA324I is manufactured by Xilinx, Inc. Xilinx is a multinational technology company known for its development of programmable logic devices and associated software tools. They specialize in creating field-programmable gate arrays (FPGAs) and other programmable integrated circuits used in various industries such as aerospace, defense, automotive, and telecommunications.

• Application Field

  The XC7S25-1CSGA324I is commonly used in applications requiring high-performance processing, such as telecommunications, industrial automation, robotics, automotive, and aerospace. It is ideal for applications that require high-speed data processing, image processing, signal processing, and complex programmable logic designs.

• Package

  The XC7S25-1CSGA324I chip is a Field Programmable Gate Array (FPGA) in a 324-ball Chip-Scale Ball Grid Array (CSBGA) package. It has a form factor of 13mm x 13mm and a size of 0.8mm ball pitch.