Xilinx XC7S15-1CSGA225C

Part points

• The XC7S15-1CSGA225C is a 7-series field programmable gate array (FPGA) chip from Xilinx. It features 15,850 logic cells, 600 kilobits of block RAM, and 60 DSP slices. This chip is designed for high-performance applications that require high-speed data processing and complex logic functions.

• Equivalent

  Some equivalent products of the XC7S15-1CSGA225C chip are XC7S15-1CSGA324C, XC7S15-1CSGA196C, XC7S15-1CSGA125C. These chips all belong to the same series and have similar specifications in terms of logic capacity, speed, and package size.

• Features

  1. Xilinx Spartan-7 FPGA 2. 1.1 million system logic cells 3. 425 GPIO pins 4. 2616 Kbits of RAM 5. 180 DSP slices 6. 4 clock management tiles 7. 16.7 Mb of Block RAM 8. 12.8Kb of Distributed RAM 9. 120 internal logic cells 10. 225-ball CSBGA package

• Pinout

  The XC7S15-1CSGA225C is a 225-pin Field Programmable Gate Array (FPGA) with 94 user I/O pins, including 35 differential pairs. It is designed for general purpose logic applications and offers high performance and low power consumption.

• Manufacturer

  The manufacturer of XC7S15-1CSGA225C is Xilinx, Inc. based in San Jose, California. Xilinx is a technology company specializing in the development and production of programmable logic devices and software tools for designing and programming electronic equipment. They are known for their field-programmable gate arrays (FPGAs) and other semiconductor products used in a wide range of industries such as aerospace, automotive, telecommunications, and data centers.

• Application Field

  The XC7S15-1CSGA225C is commonly used in applications requiring low power consumption and high-speed processing. It is suitable for industrial control systems, automotive electronics, communication equipment, medical devices, and consumer electronics. It can also be used in data acquisition systems, network switches, and embedded systems.

• Package

  The XC7S15-1CSGA225C chip is a Field Programmable Gate Array (FPGA) integrated circuit enclosed in a 225-pin Chip Scale BGA (Ball Grid Array) package. The package form factor is a square with dimensions of approximately 17 mm x 17 mm.