Xilinx XC7K325T-1FBG900C

Part points

• The XC7K325T-1FBG900C is a high-performance FPGA chip from Xilinx, featuring 324,720 logic cells, 16.3 Mb of RAM, and 1,360 DSP slices. It operates at a speed grade of -1 and is ideal for applications requiring complex processing tasks such as telecommunications, networking, and high-performance computing.

• Equivalent

  Some equivalent products of the XC7K325T-1FBG900C chip include Xilinx XC7K325T-1FBG676C, XC7K325T-1FFG676C, and XC7K325T-2FBG676C. These chips have similar features and performance capabilities.

• Features

  The XC7K325T-1FBG900C is a Xilinx Kintex-7 FPGA with 325,000 logic cells, 1,030 DSP slices, 2.15Mb block RAM, and 720 IOs. It operates at a speed grade of -1 and is built on a 28nm process. This FPGA has extensive programmability and flexibility for a wide range of applications.

• Pinout

  The XC7K325T-1FBG900C is a Xilinx Kintex-7 FPGA with 900 pins. It features a high logic density, high-capacity DSP slices, and various built-in connectivity interfaces for high-performance computing applications.

• Manufacturer

  XC7K325T-1FBG900C is manufactured by Xilinx Inc. It is a multinational semiconductor company specializing in programmable logic devices, software design tools, and IP cores. Xilinx is known for its field-programmable gate arrays (FPGAs) and offers solutions for a wide range of industries including aerospace, automotive, telecommunications, and data center applications.

• Application Field

  The XC7K325T-1FBG900C is a high-performance field-programmable gate array (FPGA) commonly used in applications such as data center acceleration, networking, automotive, aerospace, and telecommunications. It is also found in industrial automation, image processing, and video processing systems that require high processing power and flexibility.

• Package

  The XC7K325T-1FBG900C chip is a BGA (Ball Grid Array) package with a size of 900-pin, with a form factor of 29mm x 29mm.