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$5000Xilinx XC6VLX365T-2FFG1156I
The XC6VLX365T-2FFG1156I FPGA is designed for high-performance applications requiring advanced technology
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Marcas: AMD Xilinx, Inc
Parte do fabricante #: XC6VLX365T-2FFG1156I
Ficha de dados: XC6VLX365T-2FFG1156I Datasheet (PDF)
Pacote/Caso: BGA-1156
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Status RoHS:
Condição de estoque: 2.454 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC6VLX365T-2FFG1156I Descrição geral
The XC6VLX365T-2FFG1156I is a cutting-edge FPGA from Xilinx's Virtex-6 family, boasting an impressive 365,760 logic cells. This level of processing power makes it an ideal choice for a diverse range of applications requiring advanced data handling and complex computation. Additionally, the 2,160 Kb of block RAM enables efficient data storage and logic function implementation. With 640 I/O pins supporting various signaling standards, including LVDS and PCI Express, seamless integration with external devices is easily achievable. Moreover, the integrated PowerPC 405 processor core provides further flexibility, enabling system control or the execution of embedded software alongside the FPGA fabric. Operating at a maximum speed grade of -2, this FPGA excels in delivering high clock frequencies, catering to the demands of real-time applications
Características
IC FPGA 600 I/O 1156FCBGAIC FPGA 600 I/O 1156FCBGA![AMD Xilinx, Inc Inventory AMD Xilinx, Inc Inventory](/files/uploads/inventory/xilinx/xilinx.jpg)
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Details | Series: | XC6VLX365T |
Number of Logic Elements: | 364032 LE | Adaptive Logic Modules - ALMs: | 56880 ALM |
Embedded Memory: | 14.63 Mbit | Number of I/Os: | 600 I/O |
Supply Voltage - Min: | 1 V | Supply Voltage - Max: | 1 V |
Minimum Operating Temperature: | - 40 C | Maximum Operating Temperature: | + 100 C |
Data Rate: | 6.6 Gb/s | Number of Transceivers: | 24 Transceiver |
Mounting Style: | SMD/SMT | Package / Case: | FCBGA-1156 |
Brand: | Xilinx | Distributed RAM: | 4130 kbit |
Embedded Block RAM - EBR: | 14976 kbit | Maximum Operating Frequency: | 1600 MHz |
Moisture Sensitive: | Yes | Number of Logic Array Blocks - LABs: | 28440 LAB |
Operating Supply Voltage: | 1 V | Product Type: | FPGA - Field Programmable Gate Array |
Factory Pack Quantity: | 1 | Subcategory: | Programmable Logic ICs |
Tradename: | Virtex |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XC6VLX365T-2FFG1156I is a field-programmable gate array (FPGA) chip from Xilinx. It features 365,760 logic cells, 12.34 Mb of RAM, and 600 MHz maximum operating frequency. This chip is ideal for high-performance applications such as telecommunications, networking, and high-speed computing.
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Equivalent
Some equivalent products to the XC6VLX365T-2FFG1156I chip are the Xilinx XC6VLX365T-1FFG1156I and the Xilinx XC6VLX365T-3FFG1156I. These chips have the same specifications but different operating temperature ranges. -
Features
XC6VLX365T-2FFG1156I is a Virtex-6 FPGA from Xilinx with 365k Logic Cells, 23,760 slices, 72 DSP slices, and 870 I/Os. It operates at a maximum speed of 550 MHz and has a total memory of 3.7 Mb. The device is built on a 40nm process and features advanced DSP capabilities, making it suitable for high-performance applications. -
Pinout
XC6VLX365T-2FFG1156I is a Virtex-6 FPGA with 1156 pins. It features 365,760 logic cells, 7.33 Mb of memory, and 728 DSP slices. It also includes PCI Express Gen2, tri-mode Ethernet MACs, and 12.5 Gbps transceivers. -
Manufacturer
The XC6VLX365T-2FFG1156I is manufactured by Xilinx, an American technology company specializing in the development of field-programmable gate array (FPGA) and programmable logic devices. Xilinx is a semiconductor company that designs and sells programmable devices to companies in various industries such as aerospace, automotive, consumer electronics, and telecommunications. -
Application Field
XC6VLX365T-2FFG1156I is commonly used in high-performance applications such as telecommunications, networking, military and aerospace, automotive, and medical imaging. Its high processing power, low power consumption, and advanced features make it suitable for demanding applications that require fast and reliable data processing. -
Package
The XC6VLX365T-2FFG1156I chip is a Field-Programmable Gate Array (FPGA) with a Ball Grid Array (BGA) package type. It comes in a 1156-pin package with a form factor of Flip Chip and a size of 31mm x 31mm.
Ficha de dados PDF
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