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$5000Xilinx XC6SLX75-3FGG484I
XC6SLX75-3FGG484I FPGA Field Programmable Gate Array
Marcas: AMD Xilinx, Inc
Parte do fabricante #: XC6SLX75-3FGG484I
Ficha de dados: XC6SLX75-3FGG484I Datasheet (PDF)
Pacote/Caso: BGA-484
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Status RoHS:
Condição de estoque: 2.763 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC6SLX75-3FGG484I Descrição geral
Xilinx's XC6SLX75-3FGG484I FPGA is a versatile and cost-effective solution that excels in performance, energy efficiency, and design flexibility. Belonging to the Spartan-6 family, this FPGA is highly regarded for its ability to deliver robust performance while consuming minimal power. The "LX" designation underscores its low power characteristics, making it an ideal choice for projects that prioritize energy efficiency. With a logic capacity of approximately 75,000 cells, the XC6SLX75-3FGG484I offers a wealth of resources for implementing custom logic tailored to specific requirements. Operating at a maximum core voltage of 3.3 volts ("-3"), this FPGA ensures reliable operation across a range of applications. The FGG484I package type, featuring 484 pins in a Fine-Pitch Ball Grid Array (FBGA) configuration, enables convenient surface-mount installation and seamless connectivity to external circuitry
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Y | Product: | Spartan-6 |
Number of Logic Elements: | 74637 | Number of I/Os: | 280 I/O |
Operating Supply Voltage: | 1.2 V | Minimum Operating Temperature: | - 40 C |
Maximum Operating Temperature: | + 100 C | Mounting Style: | SMD/SMT |
Package / Case: | FCBGA-484 | Series: | XC6SLX75 |
Brand: | Xilinx | Distributed RAM: | 692 kbit |
Embedded Block RAM - EBR: | 3096 kbit | Maximum Operating Frequency: | 1080 MHz |
Moisture Sensitive: | Yes | Product Type: | FPGA - Field Programmable Gate Array |
Factory Pack Quantity: | 60 | Subcategory: | Programmable Logic ICs |
Tradename: | Spartan | Tags | XC6SLX75-3FGG, XC6SLX75-3F, XC6SLX75-3, XC6SLX7, XC6SLX, XC6SL, XC6S, XC6 |
Adaptive Logic Modules - ALMs: | 11662 ALM | Embedded Memory: | 3.02 Mbit |
Supply Voltage - Min: | 1.14 V | Supply Voltage - Max: | 1.26 V |
Data Rate: | - | Number of Transceivers: | - |
Number of Logic Array Blocks - LABs: | 5831 LAB |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XC6SLX75-3FGG484I chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It has 75,840 logic cells and offers a range of features including high-performance connectivity, automated performance analysis, and multi-gigabit serial I/O capabilities. The chip's FG484 package type indicates a fine-pitch ball grid array with 484 pins, suitable for use in various applications including telecommunications, automotive, and industrial sectors.
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Features
The XC6SLX75-3FGG484I is a Field Programmable Gate Array (FPGA) designed by Xilinx. It has a total of 75,360 logic cells, 1,920 Kbits of block RAM, and 560 DSP slices. It operates at a maximum clock frequency of 300 MHz and uses the FG484 package. It supports various communication protocols and offers advanced features for digital logic design. -
Pinout
The XC6SLX75-3FGG484I is a field-programmable gate array (FPGA) with a pin count of 484. It is designed by Xilinx and has a 75,000 logic cell count. The specific functions of each pin can be found in the datasheet of the device. -
Manufacturer
The manufacturer of the XC6SLX75-3FGG484I is Xilinx Inc. Xilinx is a prominent American technology company specializing in the development and manufacturing of programmable logic devices and related software tools. They are known for their field-programmable gate arrays (FPGA), which are integrated circuits that can be customized to execute specific functions as per user requirements. -
Application Field
The XC6SLX75-3FGG484I is a field-programmable gate array (FPGA) that can be used in various application areas, including wireless communication, industrial automation, video and image processing, and automotive applications. Its high-performance logic fabric and low power consumption make it suitable for a range of digital signal processing and control tasks. -
Package
The XC6SLX75-3FGG484I chip is offered in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package type. The package form is Grid Array, and its size is 23mm x 23mm.
Ficha de dados PDF
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