Pedidos acima de
$5000Xilinx XC6SLX75-3CSG484C
XC6SLX75-3CSG484C FPGA
Marcas: AMD Xilinx, Inc
Parte do fabricante #: XC6SLX75-3CSG484C
Ficha de dados: XC6SLX75-3CSG484C Datasheet (PDF)
Pacote/Caso: BGA-484
Status RoHS:
Condição de estoque: 3.166 peças, novo original
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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1
*Todos os preços estão em USD
Quantidade | Preço unitário | Preço Externo |
---|---|---|
1 | $181,020 | $181,020 |
200 | $70,052 | $14010,400 |
500 | $67,591 | $33795,500 |
1000 | $66,374 | $66374,000 |
Em estoque: 3.166 PCS
XC6SLX75-3CSG484C Descrição geral
Boasting 75,000 logic cells, 24 DSP slices, and 600K bits of block RAM, the XC6SLX75-3CSG484C is a robust mid-range FPGA designed by Xilinx. Its integrated features, such as 6-input lookup tables (LUTs) and efficient carry logic, contribute to its high performance and reliability. With a maximum operating frequency of 500MHz, this FPGA is well-suited for demanding applications in industrial automation, automotive systems, telecommunications, and consumer electronics. Its ability to operate with a core voltage of 1.2V and support a variety of I/O standards further underscores its flexibility and utility in diverse environments
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Y | Product: | Spartan-6 |
Number of Logic Elements: | 74637 | Number of I/Os: | 328 I/O |
Operating Supply Voltage: | 1.2 V | Minimum Operating Temperature: | 0 C |
Maximum Operating Temperature: | + 85 C | Mounting Style: | SMD/SMT |
Package / Case: | CSBGA-484 | Series: | XC6SLX75 |
Brand: | Xilinx | Distributed RAM: | 692 kbit |
Embedded Block RAM - EBR: | 3096 kbit | Maximum Operating Frequency: | 1080 MHz |
Moisture Sensitive: | Yes | Product Type: | FPGA - Field Programmable Gate Array |
Factory Pack Quantity: | 84 | Subcategory: | Programmable Logic ICs |
Tradename: | Spartan | Tags | XC6SLX75-3, XC6SLX7, XC6SLX, XC6SL, XC6S, XC6 |
Case/Package | BGA | Mount | Surface Mount |
Number of Pins | 484 | Max Operating Temperature | 85 °C |
Min Operating Temperature | 0 °C | Number of I/Os | 328 |
Number of Logic Blocks (LABs) | 5831 | Number of Logic Elements/Cells | 74637 |
Number of Registers | 93296 | Operating Supply Voltage | 1.2 V |
RAM Size | 387 kB |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XC6SLX75-3CSG484C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-6 family and has 75,000 logic cells along with various I/O ports. The chip operates at a speed grade of -3 and uses a 484-ball package. It offers advanced features for digital logic design and can be programmed to perform a wide range of tasks in various applications.
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Equivalent
The equivalent products of the XC6SLX75-3CSG484C chip are the XC6SLX75-2FGG484C, XC6SLX75-3FGG484C, and XC6SLX75-2CSG484C chips. -
Features
The XC6SLX75-3CSG484C is an FPGA from Xilinx. Its key features include a maximum of 74,880 logic cells, 5,120 slices, a clock speed of 550MHz, support for various I/O standards, built-in digital clock management, and extensive programmability for implementing various applications in areas like telecommunications, automotive, and industrial markets. -
Pinout
The XC6SLX75-3CSG484C is an FPGA (Field-Programmable Gate Array) device from Xilinx. It has 484 pins and belongs to the Spartan-6 LX family. This specific variant does not provide direct information about its pin function. The pin functions can vary based on the user's design and configuration of the FPGA. -
Manufacturer
The manufacturer of the XC6SLX75-3CSG484C is Xilinx Inc. Xilinx is an American technology company specializing in the development and manufacturing of programmable logic devices (PLDs) and associated software tools. They are known for their field-programmable gate arrays (FPGAs), which are widely used in various industries for applications such as data processing, image/video processing, networking, and more. -
Application Field
The XC6SLX75-3CSG484C is commonly used in applications such as low-power wireless communications, automotive driver assistance, high-performance computing, medical imaging, and aerospace and defense. -
Package
The XC6SLX75-3CSG484C chip is a Field-Programmable Gate Array (FPGA) with a CSP (Chip Scale Package) form factor. It measures 17mm x 17mm and has a 484-ball grid array (BGA) package.
Ficha de dados PDF
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