Xilinx XC6SLX150T-2CSG484I

Part points

• The XC6SLX150T-2CSG484I is a field-programmable gate array (FPGA) specifically designed for high-performance applications. It offers a large number of configurable logic cells, on-chip memory blocks, and other advanced features. With a maximum clock frequency of 300 MHz and 1.5 million logic cells, this chip is ideal for demanding tasks in telecommunications, industrial automation, and other industries.

• Equivalent

  Some equivalent products of XC6SLX150T-2CSG484I chip are Xilinx Spartan-6 XC6SLX150T-3CSG484I, Lattice Semiconductor LFXP10C-4F256C, and Altera Cyclone IV EP4CE115F29C7N. These chips offer similar performance, features, and compatibility with various applications.

• Features

  The XC6SLX150T-2CSG484I is a Spartan-6 FPGA by Xilinx with 147,433 logic cells, 4608 slices, 768 KB block RAM, and a maximum of 150 user I/Os. It operates at a speed of 2.5 ns and has a supply voltage of 1.14V to 1.26V.

• Pinout

  The XC6SLX150T-2CSG484I is a Spartan-6 FPGA with 484 pins. It has a capacity of 147,443 logic cells, 7,200 Kbits of block RAM, and 136 DSP slices. This FPGA is commonly used for high-performance digital signal processing, networking, and automotive applications.

• Manufacturer

  The manufacturer of XC6SLX150T-2CSG484I is Xilinx, Inc. Xilinx is an American technology company that specializes in the development and manufacture of programmable logic devices and related software. They are one of the leading providers of field-programmable gate arrays (FPGAs) and programmable logic devices in the world.

• Application Field

  The XC6SLX150T-2CSG484I is commonly used in high-performance applications such as communications, industrial automation, automotive, and aerospace. It is suited for signal processing, image/video processing, encryption, and high-speed data transfer due to its high logic capacity, integrated DSP blocks, and fast I/O connections.

• Package

  The XC6SLX150T-2CSG484I chip comes in a BGA package with a size of 23x23mm. It has a form factor of 484-ball chip-scale package and is designed for advanced applications requiring high performance and low power.