Xilinx XC6SLX150-2FGG900C

Part points

• The XC6SLX150-2FGG900C is a high-performance field-programmable gate array (FPGA) chip manufactured by Xilinx. It offers a wide range of features and capabilities, making it suitable for various applications that require high-speed data processing and system integration. The chip has 150,000 logic cells, 900-pin Fine-Pitch Ball Grid Array (FBGA) packaging, and operates at a maximum frequency of 800 MHz.

• Equivalent

  The equivalent products of the XC6SLX150-2FGG900C chip include the XC6SLX150-2FGG484C, XC6SLX150-2FGG484I, and XC6SLX150-2FGG484M chips.

• Features

  XC6SLX150-2FGG900C is a Field-Programmable Gate Array (FPGA). It has 147,443 logic cells, 6.8 Mb of block RAM, and 720 DSP slices. It operates at a speed grade of -2, with a maximum of 366 MHz. It has a total of 900 usable I/O pins and supports various interfaces, including Ethernet, USB, PCIe, and HDMI.

• Pinout

  The XC6SLX150-2FGG900C is an FPGA from Xilinx with 900 pins and a package of 900 FBGA. The pin count refers to the number of electrical connections on the device, while the function indicates that it is a Field Programmable Gate Array for programmable logic applications.

• Manufacturer

  The manufacturer of the XC6SLX150-2FGG900C is Xilinx, Inc. It is a technology company specializing in the development and production of programmable logic devices, software tools, and intellectual property cores. Xilinx is known for being a leading supplier of field-programmable gate arrays (FPGAs) and related technology products in the semiconductor industry.

• Application Field

  The XC6SLX150-2FGG900C is a Field-Programmable Gate Array (FPGA) with 147,443 logic cells, 1280KBRAM, and 900 signal I/Os. It is commonly used in applications such as communications, video processing, industrial control systems, aerospace, and defense.

• Package

  The XC6SLX150-2FGG900C chip is a Field Programmable Gate Array (FPGA) with a BGA (Ball Grid Array) package. It has a size of 29 mm x 29 mm.