Xilinx XC5VLX30-1FFG324I

Part points

• XC5VLX30-1FFG324I is a field-programmable gate array (FPGA) chip from Xilinx. It features 30,000 logic cells, 576Kbits of block RAM, and integrated connectivity for implementing various digital designs. This chip is commonly used in high-performance computing, telecommunications, and networking applications.

• Equivalent

  Some equivalent products of the XC5VLX30-1FFG324I chip are: 1. XC5VLX30T-1FFG324I 2. XC5VLX30T-1FFG668I 3. XC5VLX30T-1FFG1156I 4. XC5VLX30T-1FFG1936I 5. XC5VLX30T-2FFG668I

• Features

  1. Xilinx Virtex-5 FPGA 2. 30,816 Logic Cells 3. 1,380 Kbits Block RAM 4. 176 DSP slices 5. 6.25 Gbps transceivers 6. 324-Pin BGA package 7. Industrial Temperature Grade 8. 1.0V core voltage

• Pinout

  The XC5VLX30-1FFG324I is a field-programmable gate array (FPGA) with 324 pins. It features a 30,000 logic cell capacity and 864 inputs/outputs. This device is designed for high-speed communication, digital signal processing, and embedded systems applications.

• Manufacturer

  The manufacturer of the XC5VLX30-1FFG324I is Xilinx. It is a multinational semiconductor company known for its production of field-programmable gate arrays (FPGAs), programmable SoCs, and semiconductor IPs. Xilinx is a key player in the semiconductor industry, providing solutions for a wide range of applications including aerospace, automotive, communications, and data center markets.

• Application Field

  The XC5VLX30-1FFG324I is commonly used in applications such as telecommunications, networking, industrial automation, and automotive. It is also used in medical imaging, defense, and aerospace industries for its high-performance and flexibility in implementing complex algorithms and processing a large amount of data efficiently.

• Package

  The XC5VLX30-1FFG324I chip is a Field Programmable Gate Array (FPGA) packaged in a flip-chip, 324-pin Fine-pitch Ball Grid Array (FBGA) package, with dimensions of 17mm x 17mm and a ball pitch of 1.0mm.