Xilinx XC3SD1800A-4CSG484LI

Part points

• The XC3SD1800A-4CSG484LI is a high-performance FPGA (Field-Programmable Gate Array) chip from Xilinx. It features 1.8 million system gates, 300,000 logic cells, and 480 user I/Os. This chip offers flexible and customizable digital logic capabilities for a wide range of applications, including telecommunications, data processing, and industrial control systems.

• Equivalent

  The equivalent products of XC3SD1800A-4CSG484LI chip are XC3SD1800A-4CSG484C, XC3S1800A-4CSG484C, XC3SD1800A-4CSG484, XC3S1800A-4CSG484, XC3SD1800A-4CSG484I, XC3S1800A-4CSG484I. These chips are in the same Xilinx Spartan-3A FPGA series with the same specifications and features.

• Features

  1. XC3SD1800A-4CSG484LI is a Spartan-3A FPGA from Xilinx. 2. It has 1,800 logic cells and 282,240 bits of RAM. 3. Offers high performance and low power consumption. 4. Features 4 input/output banks with support for various standard interfaces. 5. Available in a compact 484-ball CSBGA package.

• Pinout

  The XC3SD1800A-4CSG484LI is a Xilinx Spartan-3A FPGA with 484 pins in a CSBGA package. It features an operating frequency of 400 MHz, 1.8 million system gates, and 768 KB of block RAM. Its functions include customizable logic, memory, and DSP capabilities for a variety of applications.

• Manufacturer

  The manufacturer of XC3SD1800A-4CSG484LI is Xilinx. Xilinx is a leading American technology company specializing in the design and development of programmable logic devices, such as field-programmable gate arrays (FPGAs) used in various industries including automotive, aerospace, and telecommunications.

• Application Field

  The XC3SD1800A-4CSG484LI is commonly used in industrial automation, telecommunications, aerospace, and defense applications for its high performance capabilities and reliability. It is also used in communication systems, networking equipment, medical devices, and automotive applications.

• Package

  The XC3SD1800A-4CSG484LI chip is a Field Programmable Gate Array (FPGA) offered in a 484-ball Flip-Chip Ball Grid Array (FC-BGA) package. It has a form factor of 19x19 mm and a size of 484 pins.