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Xilinx XC3S2000-4FGG900C
Rohs compliant, lead-free, and environmentally friendly
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Marcas: AMD Xilinx, Inc
Parte do fabricante #: XC3S2000-4FGG900C
Ficha de dados: XC3S2000-4FGG900C Datasheet (PDF)
Pacote/Caso: BGA-900
Status RoHS:
Condição de estoque: 2.835 peças, novo original
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*Todos os preços estão em USD
Quantidade | Preço unitário | Preço Externo |
---|---|---|
1 | $648,218 | $648,218 |
189 | $258,644 | $48883,716 |
513 | $250,000 | $128250,000 |
999 | $245,730 | $245484,270 |
Em estoque: 2.835 PCS
XC3S2000-4FGG900C Descrição geral
The XC3S2000-4FGG900C FPGA is a powerhouse in terms of performance and functionality. With 2 million system gates and a maximum operating speed of 900MHz, it can handle even the most demanding tasks with ease. Its 4-speed grade ensures smooth and efficient operations, making it a reliable choice for high-speed applications
![xc3s2000-4fgg900c xc3s2000-4fgg900c](/files/uploads/product/b/xc3s2000-4fgg900c20161230101330_8760.jpg)
Características
- It has a capacity of 2 million system gates, 68000 logic cells, and 360 DSP slices.
- It has a maximum of 950 MHz clock frequency
- It offers a 32-bit wide data path and supports Double Data Rate (DDR) memory interfaces.
- It operates on a 1.2V core voltage and a 2.5V auxiliary voltage.
Aplicativo
- This FPGA model is used in a wide range of applications including aerospace and defense, automotive, industrial automation, wired and wireless communications, and consumer electronics.
- It can be used for high-speed signal processing, data processing, and control applications.
![AMD Xilinx, Inc Inventory AMD Xilinx, Inc Inventory](/files/uploads/inventory/xilinx/xilinx.jpg)
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Details | Series: | XC3S2000 |
Number of Logic Elements: | 46080 LE | Number of I/Os: | 565 I/O |
Supply Voltage - Min: | 1.2 V | Supply Voltage - Max: | 1.2 V |
Minimum Operating Temperature: | 0 C | Maximum Operating Temperature: | + 85 C |
Mounting Style: | SMD/SMT | Package / Case: | FBGA-900 |
Brand: | Xilinx | Distributed RAM: | 320 kbit |
Embedded Block RAM - EBR: | 720 kbit | Maximum Operating Frequency: | 280 MHz |
Moisture Sensitive: | Yes | Number of Gates: | 2000000 |
Operating Supply Voltage: | 1.2 V | Product Type: | FPGA - Field Programmable Gate Array |
Factory Pack Quantity: | 1 | Subcategory: | Programmable Logic ICs |
Tradename: | Spartan |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Peças Equivalentes
Para o XC3S2000-4FGG900C componente, você pode considerar essas peças de reposição e alternativas:
Número da peça
Marcas
Pacote
Descrição
Número da peça : However,
Marcas :
Pacote :
Descrição : it is important to note that there may be differences in features and specifications among different models, and it is always recommended to consult the datasheet to ensure compatibility.
Part points
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The XC3S2000-4FGG900C chip is a member of the Spartan-3 FPGA family designed by Xilinx. It offers a high gate count of 2 million, operating at a clock frequency of up to 400 MHz, and integrates 2000 logic cells. Its FGPA architecture allows for programmable hardware functionality, making it suitable for various applications in industries like telecommunications, automotive, and aerospace.
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Features
The XC3S2000-4FGG900C is a field-programmable gate array (FPGA) with 2 million system gates, capable of operating at a maximum frequency of 450 MHz. It includes 768 input/output pins, 57744 logic cells, and 4.5Mb of embedded RAM. It also offers advanced features such as built-in serial transceivers and dynamic power management capabilities. -
Pinout
The XC3S2000-4FGG900C is an FPGA integrated circuit with a pin count of 900. It is designed for high-performance applications and contains 2,000 slices. Its main functions include providing programmable logic, memory, and configurable I/Os for various digital systems. -
Manufacturer
The manufacturer of the XC3S2000-4FGG900C is Xilinx. Xilinx is a leading American technology company that specializes in the development and production of programmable logic devices and associated software tools. They are known for their field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs) used in various industries such as aerospace, automotive, telecommunications, and more. -
Application Field
The XC3S2000-4FGG900C is a Field-Programmable Gate Array (FPGA) typically used in applications that require high-processing capabilities, such as aerospace and defense systems, video processing, telecommunications, and high-performance computing. It offers high-speed processing, flexible design options, and a large number of input/output pins for interfacing with other electronic components. -
Package
The XC3S2000-4FGG900C chip comes in a FBGA (Fine-pitch Ball Grid Array) package type. It has a form factor of 900 (FGG900) and a size of 4.25mm x 4.25mm.
Ficha de dados PDF
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