Pedidos acima de
$5000Xilinx XC3S1600E-5FGG484C
Versatile and highly configurable FPGA IC ideal for a wide range of applications
Marcas: AMD Xilinx, Inc
Parte do fabricante #: XC3S1600E-5FGG484C
Ficha de dados: XC3S1600E-5FGG484C Datasheet (PDF)
Pacote/Caso: BGA-484
Status RoHS:
Condição de estoque: 3.341 peças, novo original
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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1
*Todos os preços estão em USD
Quantidade | Preço unitário | Preço Externo |
---|---|---|
1 | $356,472 | $356,472 |
200 | $137,950 | $27590,000 |
500 | $133,102 | $66551,000 |
1000 | $130,708 | $130708,000 |
Em estoque: 3.341 PCS
XC3S1600E-5FGG484C Descrição geral
This specific model boasts a high maximum operating frequency of 500 MHz and a minimum input/output delay of 1.2 ns, delivering exceptional high-speed performance. With 112 I/O pins and 576 Kb of block RAM, the XC3S1600E-5FGG484C offers versatile connectivity options and ample temporary data storage capacity. Moreover, its configurable Logic Block architecture, complemented by on-chip resources like DCMs and PLLs, enables the implementation of complex logic functions and precise timing control
Características
"XC3S1600E": This refers to the specific FPGA family and model. In this case, it belongs to the Xilinx Spartan-3E family, with a capacity of 1600 logic cells.
"5FGG484C": This describes the FPGA's package type and pin count. In this case, it has a Fine-Pitch Ball Grid Array (FBGA) package with 484 pins.
Aplicativo
- 1600 logic cells, which are programmable building blocks that can be configured to implement digital logic functions.
- 56 kilobits (KB) of distributed RAM and 16 multipliers for digital signal processing (DSP) applications.
- Support for various I/O standards, such as LVCMOS, LVTTL, and LVDS, making it suitable for interfacing with different types of devices.
- Built-in configuration memory for storing the FPGA configuration bitstream, which defines the desired logic functions and connections.
- JTAG programming interface for configuring the FPGA during development.
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Details | Series: | XC3S1600E |
Number of Logic Elements: | 33192 LE | Number of I/Os: | 376 I/O |
Supply Voltage - Min: | 1.2 V | Supply Voltage - Max: | 1.2 V |
Minimum Operating Temperature: | 0 C | Maximum Operating Temperature: | + 85 C |
Data Rate: | 333 Mb/s | Mounting Style: | SMD/SMT |
Package / Case: | FCBGA-484 | Brand: | Xilinx |
Distributed RAM: | 231 kbit | Embedded Block RAM - EBR: | 648 kbit |
Maximum Operating Frequency: | 300 MHz | Moisture Sensitive: | Yes |
Number of Gates: | 1600000 | Operating Supply Voltage: | 1.2 V |
Product Type: | FPGA - Field Programmable Gate Array | Factory Pack Quantity: | 1 |
Subcategory: | Programmable Logic ICs |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Peças Equivalentes
Para o XC3S1600E-5FGG484C componente, você pode considerar essas peças de reposição e alternativas:
Número da peça
Marcas
Pacote
Descrição
Número da peça : Embedded
Marcas :
Pacote :
Descrição : systems: It can be used in various embedded systems applications, such as industrial automation, robotics, and automotive electronics.
Número da peça : Communication
Marcas :
Pacote :
Descrição : systems: It can be used for implementing protocols and interfaces for communication systems, such as Ethernet, USB, and UART.
Número da peça : Test
Marcas :
Pacote :
Descrição : and measurement: It can be used in test and measurement equipment for prototyping and validating digital circuits.
Part points
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The XC3S1600E-5FGG484C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It has 1,600,000 system gates, is compatible with the 1.2V voltage standard, and operates at a speed grade of -5. The chip comes in a 484-ball, fine-pitch ball grid array (FBGA) package and offers a wide range of features and capabilities for digital circuit design and implementation.
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Equivalent
Some equivalent products of the XC3S1600E-5FGG484C chip are: XC3S1600E-4FGG484C, XC3S1600E-5FGG484, and XC3S1600E-4TTG484C. -
Features
The XC3S1600E-5FGG484C is a field-programmable gate array (FPGA) with 1,600K logic cells, support for multiple I/O standards, and a high-speed serial interface. It operates at a maximum frequency of 500MHz and has 48,128 logic slices. It also supports advanced features such as embedded block RAM and DSP slices for high-performance applications. -
Pinout
The XC3S1600E-5FGG484C is an FPGA device with 484 pins. It belongs to the Spartan-3E family and has 1,600 slices, which can be used to implement various functions and logic circuits, making it suitable for a wide range of applications. -
Manufacturer
The manufacturer of the XC3S1600E-5FGG484C is Xilinx. It is a multinational technology company that specializes in the design, development, and manufacturing of programmable logic devices (PLDs) and associated software. -
Application Field
The XC3S1600E-5FGG484C is a field-programmable gate array (FPGA) that can be used in a wide range of applications including telecommunications, data processing, automotive, defense, and industrial automation. It offers high-speed data processing, flexibility, and low power consumption, making it suitable for various complex and demanding applications. -
Package
The XC3S1600E-5FGG484C chip is a 484-pin Fine-Pitch Ball Grid Array (FBGA) package type. It has 484 solder ball contacts on the bottom surface. The chip has a size of approximately 23mm x 23mm.
Ficha de dados PDF
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