Xilinx XC2VP7-6FFG672C

Part points

• XC2VP7-6FFG672C chip is a Field-Programmable Gate Array (FPGA) device produced by Xilinx. It belongs to the Virtex-II Pro family and offers 7,316 Logic Cells, 384 I/O pins, and 7.7 Mb of block RAM. The chip utilizes advanced programmable logic technology, making it suitable for various applications requiring high-performance, low-power consumption, and flexibility in circuit design.

• Features

  XC2VP7-6FFG672C is an FPGA with 672-ball fine-pitch BGA package, part of Xilinx Virtex-II Pro XC2VP7 series. It offers 6 million system gates, 21,600 logic cells, 270Kbits block RAM, 352 I/O pins, and a host of connectivity options. It supports high-performance applications and provides versatile functionality.

• Pinout

  The XC2VP7-6FFG672C is a Field Programmable Gate Array (FPGA) with a pin count of 672. It is used in various applications such as telecommunications, automotive, and aerospace. The specific functions and pin allocations can be found in the datasheet provided by the manufacturer.

• Manufacturer

  The manufacturer of the XC2VP7-6FFG672C is Xilinx. Xilinx is an American technology company that specializes in the design and manufacture of programmable logic devices, including field-programmable gate arrays (FPGAs) and associated development software.

• Application Field

  The XC2VP7-6FFG672C is a field-programmable gate array (FPGA) that is commonly used in high-performance computing, telecommunications, networking, video and image processing, and other applications that require advanced digital signal processing and high-speed data processing capabilities.

• Package

  The XC2VP7-6FFG672C chip has a 672-FCBGA (Fine-Pitch Ball Grid Array) package type. It is available in a form factor called "FFG" and has a size of 27 x 27 mm.