Xilinx XC2V500-4FGG256I

Part points

• XC2V500-4FGG256I is an FPGA (Field Programmable Gate Array) chip manufactured by Xilinx. It has a capacity of 500,000 system gates and is designed for high-performance digital logic applications. The chip offers 4 input and output banks and operates with a supply voltage of 1.5V. It has 256 pins and supports various features such as on-chip RAM and dedicated DSP blocks for efficient signal processing.

• Equivalent

  Some equivalent products of the XC2V500-4FGG256I chip include the XC2V500-4FGG256C, XC2V500-4FGG256I-SMD, and the XC2V500-4FGG256CES.

• Features

  XC2V500-4FGG256I is a field-programmable gate array (FPGA) with 500,000 system gates, operating at a maximum frequency of 533 MHz. It offers 4,000 logic cells, 192 I/O pins, and 192 Kbits of distributed RAM. It also supports various communication protocols and has integrated features like fast carry logic, 18-bit true dual-port RAM, and programmable functions.

• Pinout

  The XC2V500-4FGG256I has a pin count of 256 and is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. Its functions include programmable logic blocks, configurable I/Os, embedded memory, and DSP slices.

• Manufacturer

  The XC2V500-4FGG256I is manufactured by Xilinx Inc., which is a semiconductor company specialized in the design and production of Field Programmable Gate Arrays (FPGAs).

• Application Field

  The XC2V500-4FGG256I is a field-programmable gate array (FPGA) commonly used in digital signal processing, aerospace and defense, telecommunications, and automotive applications. It offers high performance, low power consumption, and an extensive range of features making it suitable for a wide range of complex applications.

• Package

  The package type of the XC2V500-4FGG256I chip is a 256-ball fine-pitch ball grid array (FBGA). It has a form factor of FG256, indicating a grid array with a 0.8mm ball pitch and a 17mm x 17mm body size.