Pedidos acima de
$5000Xilinx XC2V3000-4BG728I
728-Pin BGA package with 3M Gates and 32256 Cells
Marcas: AMD Xilinx, Inc
Parte do fabricante #: XC2V3000-4BG728I
Ficha de dados: XC2V3000-4BG728I Datasheet (PDF)
Pacote/Caso: BGA-728
Tipo de Produto: FPGAs (Field Programmable Gate Array)
Status RoHS:
Condição de estoque: 3.435 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC2V3000-4BG728I Descrição geral
The XC2V3000-4BG728I FPGA by Xilinx is a versatile solution that offers exceptional computational power and flexibility for a wide range of applications. With its impressive 3,072 logic cells, 68,544 bits of distributed RAM, and 72 18x18 multipliers, this FPGA is capable of handling complex mathematical operations with precision and speed. Additionally, its 728 available I/O pins can be configured to support various interface standards, making it ideal for diverse system designs. The FPGA's 728-pin BGA package ensures reliable connectivity and easy integration into PCB designs, while the dynamic power management feature allows for efficient control over power consumption based on specific application needs
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Manufacturer | Xilinx | Product Category | IC Chips |
Series | VirtexR-II | Package-Case | 728-BBGA |
Operating-Temperature | -40°C ~ 100°C (TJ) | Mounting-Type | Surface Mount |
Voltage-Supply | 1.425 V ~ 1.575 V | Supplier-Device-Package | 728-MBGA (35x35) |
Number-of-Gates | 3000000 | Number-of-I-O | 516 |
Number-of-LABs-CLBs | 3584 | Number-of-Logic-Elements-Cells | - |
Total-RAM-Bits | 1769472 | Tags | XC2V3000-4BG, XC2V3000-4B, XC2V3000-4, XC2V3000, XC2V3, XC2V, XC2 |
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
Series: | XC2V3000 | Adaptive Logic Modules - ALMs: | 14336 ALM |
Embedded Memory: | 1.69 Mbit | Number of I/Os: | 516 I/O |
Supply Voltage - Min: | 1.5 V | Supply Voltage - Max: | 1.5 V |
Minimum Operating Temperature: | - 40 C | Maximum Operating Temperature: | + 100 C |
Mounting Style: | SMD/SMT | Package / Case: | BGA-728 |
Brand: | Xilinx | Distributed RAM: | 448 kbit |
Embedded Block RAM - EBR: | 1728 kbit | Number of Gates: | 3000000 |
Number of Logic Array Blocks - LABs: | 3584 LAB | Operating Supply Voltage: | 1.5 V |
Product Type: | FPGA - Field Programmable Gate Array | Subcategory: | Programmable Logic ICs |
Tradename: | Virtex |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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XC2V3000-4BG728I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It has a capacity of 3 million system gates, 4 million equivalent ASIC gates, and 288 input/output pins. The chip offers high performance and flexibility for designing complex digital systems, making it suitable for a wide range of applications in industries such as telecommunications, automotive, and aerospace.
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Equivalent
The equivalent products of the XC2V3000-4BG728I chip are XC2V3000-4BG728, XC2V3000-4FG728I, XC2V3000-4FG728I, XC2V3000-4PG728I, and XC2V3000-4PG728C. These chips are part of the Virtex-II family and feature a 3,000 logic cell capacity and 728-pin BGA package. -
Features
XC2V3000-4BG728I is a Virtex-II Pro FPGA with 3 million system gates, 3000 logic cells, 200 I/Os, 64 KB block RAM, 40 DSP slices, and a 4 multi-gigabit transceivers. It operates at a processing speed of up to 250 MHz and is designed for advanced networking, telecommunications, and embedded processing applications. -
Pinout
The XC2V3000-4BG728I is a Field Programmable Gate Array (FPGA) with a pin count of 728 pins. It has various functions such as logic gates, flip-flops, and memory blocks that can be programmed to perform different functions in electronic circuits. -
Manufacturer
The manufacturer of the XC2V3000-4BG728I is Xilinx, Inc. Xilinx is an American technology company that specializes in the design and manufacture of programmable logic devices. They are a leading provider of FPGAs, SoCs, and 3D ICs for a wide range of industries including telecommunications, data center, automotive, and aerospace. -
Application Field
The XC2V3000-4BG728I is commonly used in applications such as aerospace and defense, telecommunications, industrial automation, and automotive industries. It is often used for high-performance computing, signal processing, image processing, and communications equipment due to its large logic capacity, advanced features, and reliability. -
Package
The XC2V3000-4BG728I chip comes in a Ball Grid Array (BGA) package with 728 pins. It has a 4-million gate capacity and a size of 45 x 45 mm.
Ficha de dados PDF
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