Xilinx XC2S50E-6FTG256C

Part points

• XC2S50E-6FTG256C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-2E family and has 50,000 system gates and 1,536 logic cells. The chip operates at a maximum speed of 200 MHz and has 2,600 flip-flops. Its package type is FTG256, and it is commonly used for various digital logic applications, prototyping, and low-volume production.

• Equivalent

  Some equivalent products of the XC2S50E-6FTG256C chip include XA2S50E-6FTG256C, XC2S50E-6FGG256C, and XA2S50E-6FGG256C.

• Features

  The XC2S50E-6FTG256C is a FPGA (Field-Programmable Gate Array) with 50,000 system gates, designed by Xilinx. It operates at a speed grade of -6, has a package type of FTG256, and uses a C-grade technology.

• Pinout

  The XC2S50E-6FTG256C is a field-programmable gate array (FPGA) with a pin count of 256. It is used for implementing customizable digital circuits. The pins provide various functionalities such as input/output, clock, power, and ground connections, allowing for the development of complex digital systems.

• Manufacturer

  The manufacturer of the XC2S50E-6FTG256C is Xilinx Inc. It is a technology company specializing in the design and production of programmable logic devices and related software.

• Application Field

  The XC2S50E-6FTG256C is a field-programmable gate array (FPGA) that can be used in various application areas such as telecommunications, automotive, industrial automation, aerospace, and consumer electronics. It offers a versatile platform for digital logic implementation, signal processing, and system integration.

• Package

  The package type of the XC2S50E-6FTG256C chip is a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. The form of the chip is a small integrated circuit. The size of the package is 17mm x 17mm.