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Intel RC28F128J3D75

Name: RC28F128J3D75
Rating: 4.5 (10 reviews)

Easy to install 64-pin EZBGA Tray

Marcas: Intel

Parte do fabricante #: RC28F128J3D75

Ficha de dados: RC28F128J3D75 Ficha de dados (PDF)

Pacote/Caso: EZBGA

Tipo de Produto: Integrated Circuits (ICs)

Status RoHS:

Condição de estoque: 3931 peças, novo original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Observação

RC28F128J3D75 Descrição geral

The RC28F128J3D75 is a flash memory component manufactured by Intel. It is a 128MB NOR flash memory module with a parallel interface that operates at 3.3V. The device is organized into 8,192 blocks, each containing 16 pages. Each page is further divided into 512 bytes of data.The RC28F128J3D75 has a fast read access time of 75ns, allowing for quick data retrieval. It also features a flexible erase capability, with both block erase and chip erase functions available. The component supports both asynchronous and synchronous read operations, providing compatibility with a wide range of systems.In terms of reliability, the RC28F128J3D75 offers a minimum of 100,000 program/erase cycles, ensuring longevity and robust performance. It also includes built-in error correction code (ECC) functionality to help maintain data integrity.The RC28F128J3D75 is suitable for a variety of applications, including embedded systems, automotive electronics, industrial control systems, and networking devices. Its high capacity, fast read speeds, and reliable performance make it a popular choice for designers looking for a dependable memory solution

Características

1. 128Mbit NOR Flash memory
2. 75ns access time
3. Low voltage operation
4. Industrial temperature range (-40°C to +85°C)
5. High performance read and program speeds
6. Flexible command interface

Aplicativo

Embedded systems
Consumer electronics
Industrial automation
Robotics
Automotive industry
Medical devices

Especificações

Parâmetro	Valor	Parâmetro	Valor
ECCN (US)	3A991b.1.a.	Part Status	Obsolete
HTS	8542.32.00.71	Automotive	No
PPAP	No	Cell Type	NOR
Chip Density (bit)	128M	Architecture	Sectored
Boot Block	No	Block Organization	Symmetrical
Address Bus Width (bit)	24/23	Sector Size	128Kbyte x 128
Page Size	4Words/8Words	Number of Bits/Word (bit)	8/16
Number of Words	16M/8M	Programmability	Yes
Timing Type	Asynchronous	Max. Access Time (ns)	75
Maximum Erase Time (s)	4/Block	Maximum Page Access Time (ns)	25
Maximum Programming Time (ms)	0.175/Byte	OE Access Time (ns)	25
Interface Type	Parallel	Minimum Operating Supply Voltage (V)	2.7
Typical Operating Supply Voltage (V)	3\|3.3	Maximum Operating Supply Voltage (V)	3.6
Programming Voltage (V)	2.7 to 3.6	Page Read Current (mA)	20@5MHz\|15@5MHz
Program Current (mA)	70	Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85	Command Compatible	Yes
ECC Support	No	Support of Page Mode	Yes
Packaging	Tray	Mounting	Surface Mount
Package Height	0.78	Package Width	10
Package Length	13	PCB changed	64
Standard Package Name	BGA	Supplier Package	EZBGA
Pin Count	64

Envio

	Taxa de envio	Tempo de espera
DHL	$20.00-$40.00 (0.50 KG)	2-5 dias
FedEx	$20.00-$40.00 (0.50 KG)	2-5 dias
UPS	$20.00-$40.00 (0.50 KG)	2-5 dias
TNT	$20.00-$40.00 (0.50 KG)	2-5 dias
EMS	$20.00-$40.00 (0.50 KG)	2-5 dias
CORREIO AÉREO REGISTADO	$20.00-$40.00 (0.50 KG)	2-5 dias

Tempo de processamento: A taxa de envio depende de diferentes zonas e países.

Pagamento

Termos de pagamento		Taxa de mão
	Transferência bancária	cobrar taxa bancária de US$ 30,00.
	PayPal	cobrar taxa de serviço de 4,0%.
	Cartão de crédito	cobrar taxa de serviço de 3,5%.
	Western Union	charge US.00 banking fee.
	Grama de dinheiro	cobrar taxa bancária de US$ 0,00.

Garantias

1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.

2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.

Embalagem

Etapa1 :produtos
Etapa2 :Embalagem a vácuo
Etapa3 :Saco antiestático
Etapa4 :Embalagem individual
Etapa5 :Caixas de embalagem
Etapa6 :etiqueta de envio com código de barras

Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.

Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.

Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.

Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.

Part points

The RC28F128J3D75 is a 128 Mbit (16 MByte) flash memory chip from Intel that offers high performance and reliability for a variety of applications. It features a 75 ns access time, a 3V power supply, and a 64-word write buffer. The chip is commonly used in embedded systems, consumer electronics, and networking devices.
Equivalent

Some equivalent products of the RC28F128J3D75 chip include the AT28C64B-20PU, M29F800FB5AN6E2, and IS61LPSD03232A-200B3. These chips have similar specifications and may be used as replacements for the RC28F128J3D75 in various applications.
Features

RC28F128J3D75 is a 128GB NAND flash memory chip with 75nm technology. It features a low power consumption, high data transfer rates, and wear leveling algorithms for increased reliability. The chip also has advanced error correction capabilities and a wide operating temperature range.
Pinout

The RC28F128J3D75 is a 128Mb parallel flash memory with a 48-pin TSOP package. Pin function includes address/data bus, control signals, and power/ground connections.
Manufacturer

The manufacturer of the RC28F128J3D75 is Intel Corporation, an American multinational corporation and technology company. Intel primarily designs and manufactures semiconductor chips and related hardware products for a variety of industries, including computer, networking, and communication technologies.
Application Field

The RC28F128J3D75 is commonly used in applications such as networking equipment, industrial automation, medical devices, communication systems, and aerospace technology. It is suitable for high-end embedded systems that require high performance, reliability, and security features.
Package

The RC28F128J3D75 chip is in a TSOP package type, with a 48-pin form, and a size of 14mm x 20mm.