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Intel RC28F128J3C150

Name: RC28F128J3C150
Rating: 4.5 (10 reviews)

16M x 8/8M x 16 Parallel NOR Flash Memory

Marcas: Intel

Parte do fabricante #: RC28F128J3C150

Ficha de dados: RC28F128J3C150 Datasheet (PDF)

Pacote/Caso: EZBGA

Tipo de Produto: Integrated Circuits (ICs)

Status RoHS:

Condição de estoque: 2958 peças, novo original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Observação

RC28F128J3C150 Descrição geral

The RC28F128J3C150 is a flash memory device manufactured by Intel. It is part of the 28F Series of parallel NOR Flash memory products and offers a high level of reliability and performance. Key details of the RC28F128J3C150 include a memory capacity of 128 megabits (16 megabytes), organized into 16 sectors of 256K bytes each. It features a 1.8V/3V power supply, with a page size of 512 bytes and a block erase size of 16K bytes. The device is designed for a wide operational temperature range of -40°C to 85°C.The RC28F128J3C150 is ideal for applications where high performance and reliability are crucial, such as automotive, industrial, and networking systems. It offers fast read and program times, as well as high endurance and data retention capabilities.In terms of packaging, the RC28F128J3C150 is housed in a 64-ball Fortified BGA (FBGA) package, which provides a compact and reliable solution for mounting the device onto printed circuit boards.

Características

128Mb capacity
3V voltage
150ns access time
Compatible with parallel NOR flash interface
Operates in industrial temperature range
Low power consumption
High reliability and endurance
Available in a 56-pin TSOP package

Aplicativo

Industrial automation
Consumer electronics
Telecommunications
Medical devices
Automotive systems
Smart appliances
Networking equipment
Security systems
Gaming consoles
Military applications

Especificações

Parâmetro	Valor	Parâmetro	Valor
ECCN (US)	3A991.b.1.a	Part Status	Obsolete
Automotive	No	PPAP	No
Cell Type	NOR	Chip Density (bit)	128M
Architecture	Sectored	Boot Block	No
Block Organization	Symmetrical	Address Bus Width (bit)	24/23
Sector Size	128Kbyte x 128	Page Size	4Words/8Words
Number of Bits/Word (bit)	8/16	Number of Words	16M/8M
Programmability	Yes	Timing Type	Asynchronous
Max. Access Time (ns)	150	Maximum Erase Time (s)	5/Block
Maximum Page Access Time (ns)	25	Maximum Programming Time (ms)	0.63/Byte
OE Access Time (ns)	25	Process Technology	CMOS
Interface Type	Parallel	Minimum Operating Supply Voltage (V)	2.7
Typical Operating Supply Voltage (V)	3\|3.3	Maximum Operating Supply Voltage (V)	3.6
Programming Voltage (V)	2.7 to 3.6	Page Read Current (mA)	54
Minimum Operating Temperature (°C)	-40	Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Extended	Command Compatible	No
ECC Support	No	Support of Page Mode	Yes
Packaging	Tray	Mounting	Surface Mount
Package Height	0.78	Package Width	10
Package Length	13	PCB changed	64
Standard Package Name	BGA	Supplier Package	EZBGA
Pin Count	64

Envio

	Taxa de envio	Tempo de espera
DHL	$20.00-$40.00 (0.50 KG)	2-5 dias
FedEx	$20.00-$40.00 (0.50 KG)	2-5 dias
UPS	$20.00-$40.00 (0.50 KG)	2-5 dias
TNT	$20.00-$40.00 (0.50 KG)	2-5 dias
EMS	$20.00-$40.00 (0.50 KG)	2-5 dias
CORREIO AÉREO REGISTADO	$20.00-$40.00 (0.50 KG)	2-5 dias

Tempo de processamento: A taxa de envio depende de diferentes zonas e países.

Pagamento

Termos de pagamento		Taxa de mão
	Transferência bancária	cobrar taxa bancária de US$ 30,00.
	PayPal	cobrar taxa de serviço de 4,0%.
	Cartão de crédito	cobrar taxa de serviço de 3,5%.
	Western Union	charge US.00 banking fee.
	Grama de dinheiro	cobrar taxa bancária de US$ 0,00.

Garantias

1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.

2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.

Embalagem

Etapa1 :produtos
Etapa2 :Embalagem a vácuo
Etapa3 :Saco antiestático
Etapa4 :Embalagem individual
Etapa5 :Caixas de embalagem
Etapa6 :etiqueta de envio com código de barras

Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.

Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.

Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.

Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.

Part points

The RC28F128J3C150 is a flash memory chip manufactured by Intel. It has a storage capacity of 128 megabits and operates at a maximum clock frequency of 150 MHz. This chip is commonly used in embedded systems and industrial applications where non-volatile memory is required for program storage.
Equivalent

The equivalent products of the RC28F128J3C150 chip are the Micron N28F128J3A150, the Macronix MX28F128J3C150, and the Samsung KS28F128J3C150. These chips are all flash memory products with similar specifications and features.
Features

RC28F128J3C150 is a NOR flash memory chip with a capacity of 128MB. It operates on a voltage of 1.7V to 1.95V and has a maximum clock frequency of 133MHz. It has a 2K-word block erase capability and a 64-word page programming capability. It also has a 100,000-cycle endurance rating.
Pinout

The RC28F128J3C150 is a 150 MHz, 128 Mb NOR Flash memory with a 64-bit 2.5 V interface. It has a 64-ball Fine-pitch Ball Grid Array (FBGA) package with a 0.75 mm pitch. The pin count is 64, and it provides non-volatile storage for embedded systems and other applications.
Manufacturer

The manufacturer of the RC28F128J3C150 is Intel Corporation. It is an American multinational corporation that develops and manufactures microprocessors, integrated circuits, and other computer-related technologies. Intel is one of the largest semiconductor chip makers in the world and supplies components for a wide range of electronic devices including PCs, smartphones, and servers.
Application Field

The RC28F128J3C150 is commonly used in networking equipment, telecommunications systems, industrial automation, automotive applications, and medical devices. It is also suitable for use in embedded systems, consumer electronics, and other applications that require high performance and reliable non-volatile storage solutions.
Package

The RC28F128J3C150 chip comes in a BGA package type with a 90-ball grid array form. It has a size of 8mm x 9mm x 1.0mm.