ADI OP777ARZ

Part points

• The OP777ARZ chip is a precision operational amplifier designed for use in various applications such as test and measurement equipment, industrial controls, and audio applications. It offers low offset voltage, low input bias current, and high open-loop gain, resulting in accurate and reliable performance. The chip is available in a small surface-mount package and operates over a wide temperature range.

• Equivalent

  Some equivalent products of the OP777ARZ chip are the AD8561, AD8553, TLV2461, and LTC6915.

• Features

  The main features of OP777ARZ are a low offset voltage of 25μV, low input bias current of 100pA, low noise of 7nV/√Hz, high open-loop gain of 140dB, wide supply voltage range of ±1.35V to ±18V, and a unity-gain bandwidth of 2MHz. It is a precision operational amplifier (op-amp) suitable for a wide range of applications that require high precision and low noise performance.

• Pinout

  The OP777ARZ is an operational amplifier with 8 pins. The pin functions are as follows: Pin 1 is the null, Pin 2 is the inverting input, Pin 3 is the non-inverting input, Pin 4 is the V- (negative power supply), Pin 5 is the offset null, Pin 6 is the output, Pin 7 is the V+ (positive power supply), and Pin 8 is the balance.

• Manufacturer

  Texas Instruments is the manufacturer of the OP777ARZ. It is a semiconductor manufacturing company that designs and produces a range of integrated circuits and electronic components for various industries, including consumer electronics, automotive, industrial, and communications.

• Application Field

  The OP777ARZ is a precision operational amplifier commonly used in applications requiring low offset voltage and high input impedance. It is suitable for precision instrumentation, medical equipment, test and measurement devices, and audio applications where high accuracy and low noise operation are critical.

• Package

  The package type of the OP777ARZ chip is in a 8-pin SOIC (Small Outline Integrated Circuit) package. The form is in a surface mount. The size of the chip is determined by the dimensions of the SOIC package, which typically measures around 5.3mm x 6.2mm.