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NXP MPC860TCVR66D4
Microprocessors - MPU POWER QUICC-NO LEAD
Marcas: NXP Semiconductor
Parte do fabricante #: MPC860TCVR66D4
Ficha de dados: MPC860TCVR66D4 Datasheet (PDF)
Pacote/Caso: BGA-357
Status RoHS:
Condição de estoque: 3.536 peças, novo original
Tipo de Produto: Microprocessors
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*Todos os preços estão em USD
| Quantidade | Preço unitário | Preço Externo |
|---|---|---|
| 1 | $590,714 | $590,714 |
| 220 | $228,599 | $50291,780 |
| 484 | $220,565 | $106753,460 |
| 1012 | $216,594 | $219193,128 |
Em estoque: 3.536 PCS
MPC860TCVR66D4 Descrição geral
The MPC860TCVR66D4 stands out as a powerhouse within the PowerPC family, tailor-made for embedded applications that demand nothing short of top-tier performance. Boasting a clock speed of 66 MHz and built on the robust PowerPC 603e core, this processor is primed to deliver exceptional results for its designated functions. Equipped with a 32-bit architecture and an integrated floating-point unit (FPU), it excels in handling complex numerical tasks with unparalleled efficiency. Moreover, the MPC860TCVR66D4 is furnished with a diverse array of peripheral interfaces including UART, SPI, I2C, and Ethernet, ensuring seamless connectivity options for embedded systems. Its on-chip memory management unit (MMU) support further enhances performance by streamlining memory access and management for multitasking operating systems. Unquestionably, this processor is the ideal choice for a wide spectrum of embedded applications ranging from industrial control systems to networking equipment and automotive electronics, where steadfast reliability and real-time performance are imperative
Características
- This PowerQUICC processor integrates multiple functions onto a single chip
- The MPC860TCVR66D4 is a highly integrated processor with enhanced communication capabilities
- It features advanced peripherals and memory management units for efficient data transfer
- This powerful processor has on-chip serial interfaces, DMA controllers, and memory management
- The MPC860TCVR66D4 processor combines multiple functions onto one chip for improved performance
- This highly integrated processor integrates many functions including memory management
Aplicativo
- Automotive systems
- for its
- performance
Especificações
| Parâmetro | Valor | Parâmetro | Valor |
|---|---|---|---|
| Pin Count | 357 | Package Category | BGA |
| Released Date | Mar 14, 2023 |
Envio
| Tipo de envio | Taxa de envio | Tempo de espera | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
| Termos de pagamento | Taxa de mão | |
|---|---|---|
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The MPC860TCVR66D4 chip is a PowerQUICC II Pro processor that features a dual-core architecture and is designed for networking applications. It offers a high level of integration, including a system controller, security engine, Ethernet interface, and Fast Ethernet MACs. The chip is known for its reliability, performance, and flexibility in networking environments.
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Features
The MPC860TCVR66D4 is a microprocessor with a PowerPC architecture. It features a clock speed of 66 MHz, a dual-issue, superscalar core, and a 32-bit internal data bus. It also has integrated peripherals, including a memory controller, a time base, and a communication controller, making it suitable for embedded systems applications. -
Pinout
The MPC860TCVR66D4 has 196 pins and is a microprocessing unit from the PowerPC 8xx family. It is commonly used in embedded systems and features a 66 MHz clock speed. The pins serve various functions, including data and address bus connections, control signals, clock inputs, and power and ground connections. -
Manufacturer
The manufacturer of the MPC860TCVR66D4 is NXP Semiconductors. NXP is a semiconductor and software company that provides solutions for automotive, industrial, mobile, and communication sectors. They specialize in high-performance mixed-signal electronics and are known for their expertise in developing secure connectivity solutions, microcontrollers, and integrated circuits. -
Application Field
The MPC860TCVR66D4 is a microprocessor commonly used in embedded systems and telecommunication applications. It is suited for various application areas such as network routers, switches, industrial control systems, automotive systems, and telecommunications infrastructure. Its features and capabilities make it suitable for real-time, high-performance computing in these diverse fields. -
Package
The MPC860TCVR66D4 chip is in a 256-BBGA package type, with a ball grid array (BGA) form, and its size is 17mm x 17mm.
Ficha de dados PDF
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