MP240D3

Part points

• The MP240D3 chip is a hardware component designed for embedded systems such as IoT devices, wearables, and industrial applications. It features low power consumption, high performance, and flexibility for a wide range of applications. The chip integrates processing, memory, and connectivity functions to enable efficient and reliable operation in various scenarios.

• Equivalent

  The equivalent products of MP240D3 chip are C8051F960, Si4781, ISL2M851, LMH0044, and PI74ALVC162841A. These chips are all similar in functionality and features, making them potential replacements for the MP240D3 chip in various electronic applications.

• Features

  The MP240D3 is a 24-inch industrial monitor with a durable metal housing, VGA and DVI inputs, and a resistive touch screen. It has a high resolution of 1920x1080 pixels, a wide operating temperature range of -10°C to 60°C, and can be panel-mounted for easy integration into industrial environments.

• Pinout

  The MP240D3 has a 16-pin count and functions as a voltage regulator and power management IC. It is designed to provide stable power supply to various electronic devices.

• Manufacturer

  The manufacturer of the MP240D3 is Micron Technology. Micron is a multinational corporation that specializes in producing semiconductor products, including dynamic random-access memory (DRAM), NAND flash memory, SSDs, and other memory and storage technologies. Micron is a leading supplier of memory solutions for a wide range of industries, including consumer electronics, automotive, and enterprise computing.

• Application Field

  The MP240D3 is commonly used in the following application areas: 1. Industrial automation 2. Power distribution systems 3. Building management systems 4. Renewable energy installations 5. Telecommunications 6. Control and monitoring systems Its compact size, high accuracy, and wide voltage range make it ideal for various power monitoring and measurement applications.

• Package

  The MP240D3 chip comes in a BGA (Ball Grid Array) package type. It is in a dual form, which means it has two separate cores within the chip. The size of the chip is approximately 14mm x 14mm.