Renesas PS7241E-1A-F3-A

Part points

• The PS7241E-1A-F3-A is a chip used for high-speed data communication and signal isolation. It offers a high operating temperature range and low power consumption. This chip is commonly utilized in various applications that require reliable and robust isolation between different components or systems to ensure data integrity and protection against voltage spikes or noise interference.

• Equivalent

  There are no direct equivalent products of the PS7241E-1A-F3-A chip. However, other similar chips in the PS7241 series, such as PS7241E-1A-F3 and PS7241E-1A-F4, may serve as alternatives depending on the specific requirements and application. It is recommended to consult the product datasheet or contact the manufacturer for more information.

• Features

  The PS7241E-1A-F3-A is an optically isolated 4-channel high-speed logic gate optocoupler. It operates at a data rate of 10 Mbps and offers a wide temperature range of -40°C to +100°C with high noise immunity. It features a high common-mode transient immunity of ±15 kV/μs, making it suitable for high-speed communication and industrial applications.

• Pinout

  The PS7241E-1A-F3-A is a 4-pin optocoupler IC. It consists of an infrared LED and a photo-transistor optically coupled and housed in a small package. The primary function of this device is to provide electrical isolation and noise immunity between the input and output circuits in electronic systems.

• Manufacturer

  The manufacturer of the PS7241E-1A-F3-A is CEL (California Eastern Laboratories). It is a global provider of RF and optoelectronic components.

• Application Field

  The PS7241E-1A-F3-A is commonly used in applications such as photovoltaic power conditioning systems, medical equipment, and industrial automation. It is specifically designed for use in high-speed digital systems, offers high current transfer ratio, low coupling capacitance, and high isolation voltage.

• Package

  The PS7241E-1A-F3-A chip comes in a Surface Mount Device (SMD) package type and has a form factor of a dual inline package (DIP). It has a small size, which means it occupies a compact area on the circuit board.