LATTICE LFE5U-25F-6BG256I

Part points

• The LFE5U-25F-6BG256I chip is a low-power, small form factor FPGA (Field-Programmable Gate Array) manufactured by Lattice Semiconductor. With 25k LUTs, 1031 KB memory, and 34 DSP blocks, it is suitable for a wide range of applications including IoT, industrial automation, and communication systems. The chip also features a high-speed SERDES interface and on-chip oscillators for increased flexibility.

• Equivalent

  The equivalent products of LFE5U-25F-6BG256I chip are LFE5U-25F-6BG381C, LFE5U-45F-6BG256I, and LFE5U-25F-6BG381I. These chips all belong to the Lattice ECP5 FPGA family and share similar features and specifications, offering a range of options for designers looking for alternatives to the LFE5U-25F-6BG256I.

• Features

  The LFE5U-25F-6BG256I is a low-cost, low-power FPGA with 25K LUTs, 22.5 Kb of distributed RAM, and 2 PLLs. It features 179 user I/Os, SPI and JTAG programming interfaces, and support for 3.3V and 2.5V power supplies. It also has embedded block RAM and DSP blocks for signal processing applications.

• Pinout

  The LFE5U-25F-6BG256I is a 256-pin FPGA featuring 25k LUTs with embedded SERDES, designed for ultra-low power applications. It offers features such as high-speed communication interfaces, DSP blocks, and low-power standby modes. The specific pin functions can be found in the datasheet provided by the manufacturer.

• Manufacturer

  The LFE5U-25F-6BG256I is a product manufactured by Lattice Semiconductor Corporation, a leading provider of customizable smart connectivity solutions. Lattice Semiconductor Corporation is a fabless semiconductor company that specializes in FPGA (field-programmable gate array) technology and related products for a wide range of applications in the telecommunications, automotive, industrial, and consumer markets.

• Application Field

  The LFE5U-25F-6BG256I is ideal for applications such as industrial automation, automotive, communications, and consumer electronics. It can be used in programmable logic controllers (PLCs), video processing, smart sensors, and high-speed networking devices. Additionally, its low power consumption and high-performance capabilities make it suitable for battery-powered applications.

• Package

  The LFE5U-25F-6BG256I chip is in a Ball Grid Array (BGA) package with 256 pins. The chip has a form factor of 12x12mm and is a 25K LUT, 1.1Mbit RAM, 159 IO, 548Kbit Distributed RAM FPGA in a 6 speed grade.