LATTICE LCMXO2-7000HC-4BG256I

Part points

• The LCMXO2-7000HC-4BG256I chip is an FPGA (Field-Programmable Gate Array) that offers 7,000 Look-Up Tables (LUTs), various I/O pins, and is available in a 256-ball grid array package. It provides low power consumption, high performance, and offers versatile programmability for a wide range of applications, including digital logic designs, signal processing, and more.

• Equivalent

  The equivalent products of the LCMXO2-7000HC-4BG256I chip include LCMXO2-7000HC-4BG256C, LCMXO2-7000HC-4FTG256C, LCMXO2-7000HC-4BG256CES, LCMXO2-7000HC-4MG256C, and LCMXO2-7000HC-4UMG256C.

• Features

  LCMXO2-7000HC-4BG256I is a low-cost FPGA device by Lattice Semiconductor. It features 7000 Look-Up Tables (LUTs), delivers flexible, low-power programmable technology, and supports up to 266 user I/Os. Additionally, it offers instant-on capability, on-chip oscillator, and is suitable for a variety of applications including consumer, industrial, and portable devices.

• Pinout

  The LCMXO2-7000HC-4BG256I is a type of field-programmable gate array (FPGA) with a pin count of 256. It offers flexible logic and low-power consumption, making it suitable for various applications. The specific functions of the pins may vary depending on the design and configuration of the FPGA.

• Manufacturer

  The manufacturer of the LCMXO2-7000HC-4BG256I is Lattice Semiconductor. It is a global company specializing in low-power, small form-factor programmable logic devices (PLDs). They provide smart connectivity solutions for various industries, including consumer electronics, automotive, industrial, and communications.

• Application Field

  The LCMXO2-7000HC-4BG256I is a low-cost, low-power FPGA that is ideal for applications such as industrial automation, automotive systems, consumer electronics, and communications. Its small size, low power consumption, and flexibility make it suitable for various high-performance and low-power applications.

• Package

  The LCMXO2-7000HC-4BG256I chip has a Ball Grid Array (BGA) package type. Its form is a grid array, which means the electrical connections are arranged in a grid pattern. The size of the chip is 256-ball, indicating the number of solder balls on its underside.