ON FOD817C

Part points

• The FOD817C is a chip commonly used for optocoupler applications. it consists of an infrared emitting diode and a npn silicon phototransistor, used for providing electrical isolation between input and output circuits. with its compact size and high isolation voltage capabilities, it is widely used in areas such as automotive, telecommunications, and power supply applications.

• Equivalent

  The equivalent products of the FOD817C chip include tcmt1109, ps817c, and sfh6136, as they are all optocoupler chips with similar specifications and functionalities.

• Features

  The FOD817C is an optocoupler device that includes a phototransistor and an infrared emitting diode. it has a compact size and high isolation voltage, making it suitable for use in various applications such as digital logic inputs, microprocessor inputs, and interface modules.

• Pinout

  The FOD817C is a 4-pin optocoupler. it consists of an infrared emitting diode and a npn silicon phototransistor. its pins include anode (pin 1), cathode (pin 2), collector (pin 3), and emitter (pin 4). it is commonly used to isolate low-voltage digital signals and control high-voltage loads.

• Manufacturer

  The manufacturer of the FOD817C is fairchild semiconductor corporation. it is an american company that specializes in the design, development, and production of power and signal management, logic, discrete, and custom semiconductor solutions.

• Application Field

  The FOD817C is a phototransistor optocoupler used for high-speed switching in applications such as industrial automation, power supplies, motor control, and telecommunication devices.

• Package

  The FOD817C is a chip optocoupler with a dual-in-line package (dip) type. it has a 4-pin configuration with a through-hole form, meaning it is designed for mounting onto a circuit board using pins inserted into small holes. the size dimensions of the chip are typically 10.16mm x 6.35mm x 8.51mm.