Pedidos acima de
$5000FDS8858CZ
Mosfet Array 30V 8.6A, 7.3A 900mW Surface Mount 8-SOIC
Marcas: ONSEMI
Parte do fabricante #: FDS8858CZ
Ficha de dados: FDS8858CZ Ficha de dados (PDF)
Pacote/Caso: SOIC-8
Tipo de Produto: FET, MOSFET Arrays
Status RoHS:
Condição de estoque: 7.941 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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FDS8858CZ Descrição geral
These dual N and P-Channel enhancement mode power MOSFETs are produced using an advanced PowerTrench® process that has been especially tailored to minimize on-state resistance and yet maintain superior switching performance.
These devices are well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required.
Características
- Q1 N-Channel
Max. RDS(on) = 17 mΩ at VGS = 10 V, ID = 8.6 A
Max. RDS(on) = 20 mΩ at VGS = 4.5 V, ID = 7.3 A - Q2 P-Channel
Max. RDS(on) = 20.5 mΩ at VGS = -10 V, ID = -7.3 A
Max. RDS(on) = 34.5 mΩ at VGS = -4.5 V, ID = -5.6 A - High Power and Current Handling Capability in a Widely Used Surface Mount Package
- Fast Switching Speed
Aplicativo
- This product is general usage and suitable for many different applications.
- Inverter
- Synchronous Buck
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Source Content uid | FDS8858CZ | Pbfree Code | Yes |
Part Life Cycle Code | Active | Ihs Manufacturer | ONSEMI |
Package Description | ROHS COMPLIANT, 8 PIN | Manufacturer Package Code | 751EB |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
Factory Lead Time | 58 Weeks | Samacsys Manufacturer | onsemi |
Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | DS Breakdown Voltage-Min | 30 V |
Drain Current-Max (ID) | 8.6 A | Drain-source On Resistance-Max | 0.017 Ω |
FET Technology | METAL-OXIDE SEMICONDUCTOR | JESD-30 Code | R-PDSO-G8 |
JESD-609 Code | e3 | Moisture Sensitivity Level | 1 |
Number of Elements | 2 | Number of Terminals | 8 |
Operating Mode | ENHANCEMENT MODE | Operating Temperature-Max | 150 °C |
Package Body Material | PLASTIC/EPOXY | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE | Peak Reflow Temperature (Cel) | 260 |
Polarity/Channel Type | N-CHANNEL AND P-CHANNEL | Power Dissipation-Max (Abs) | 2 W |
Pulsed Drain Current-Max (IDM) | 20 A | Qualification Status | Not Qualified |
Surface Mount | YES | Terminal Finish | MATTE TIN |
Terminal Form | GULL WING | Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 | Transistor Application | SWITCHING |
Transistor Element Material | SILICON |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The FDS8858CZ is a power MOSFET chip that is designed for high performance and efficiency in a range of applications, including power supplies and motor control. This chip offers low on-resistance, high current capability, and fast switching speeds, making it ideal for use in various electronic devices requiring power management.
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Equivalent
The equivalent products of FDS8858CZ chip are FDS8855CZ, FDS8853CZ, and FDS8850CZ. These are all N-channel PowerTrench MOSFETs with similar specifications and performance characteristics. -
Features
The FDS8858CZ is a dual N-channel PowerTrench MOSFET with a compact package and a low on-state resistance. It has a maximum continuous drain current of 2.7A, low gate charge, and low gate threshold voltage. It is suitable for a wide range of applications requiring high efficiency and power density. -
Pinout
The FDS8858CZ is a Dual N-Channel PowerTrench MOSFET with a 8-pin Power-56 (3x3) package. Pin function includes gate control (pins 1 and 4), drain connection (pins 2 and 7), and source connection (pins 3 and 6). Pin 5 is the thermal pad. -
Manufacturer
Fairchild Semiconductor is the manufacturer of FDS8858CZ. It is a semiconductor company that specializes in the design and production of power management and analog semiconductor solutions for various applications such as mobile, industrial, automotive, and consumer electronics. Fairchild Semiconductor was acquired by ON Semiconductor in 2016, but continues to operate as a separate entity. -
Application Field
FDS8858CZ is commonly used in power management applications such as voltage regulation, power distribution, and battery charging for various electronic devices including smartphones, tablets, laptops, and wearable technology. It is also used in automotive systems, industrial control, and power supplies. -
Package
The FDS8858CZ chip comes in a DFN-8 package type with a form factor of surface mount. It measures 3mm x 3mm in size.
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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