Pedidos acima de
$5000FDC6306P
Mosfet Array 20V 1.9A 700mW Surface Mount SuperSOT™-6
Marcas: ONSEMI
Parte do fabricante #: FDC6306P
Ficha de dados: FDC6306P Ficha de dados (PDF)
Pacote/Caso: TSOT-23-6
Status RoHS:
Condição de estoque: 8.706 peças, novo original
Tipo de Produto: FET, MOSFET Arrays
Warranty: 1 Year Ovaga Warranty - Find Out More
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1
*Todos os preços estão em USD
Quantidade | Preço unitário | Preço Externo |
---|---|---|
5 | $0,122 | $0,610 |
50 | $0,099 | $4,950 |
150 | $0,087 | $13,050 |
500 | $0,079 | $39,500 |
3000 | $0,072 | $216,000 |
6000 | $0,068 | $408,000 |
Em estoque: 8.706 PCS
FDC6306P Descrição geral
With the FDC6306P, efficiency and performance go hand in hand. This MOSFET is engineered to deliver maximum power in a small footprint, offering cost-effective solutions for a wide range of electronic devices. The advanced technology behind the PowerTrench process ensures that this device maintains low on-state resistance and high switching performance, making it suitable for demanding applications
Características
- -1.9 A, -20 V
- RDS(on) = 0.170 Ω @ VGS = -4.5 V
- RDS(on) = 0.250 Ω @ VGS = -2.5 V
- Low gate charge (2.3nC typical)
- Fast switching speed
- High performance trench technology for extremely low RDS(ON)
- SuperSOT™-6 package: small footprint (72% smaller than standard SO-8); low profile (1mm thick)
Aplicativo
- This product is general usage and suitable for many different applications.
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Source Content uid | FDC6306P | Pbfree Code | Yes |
Part Life Cycle Code | Active | Ihs Manufacturer | ONSEMI |
Package Description | SUPERSOT-6 | Manufacturer Package Code | 419BL |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
Samacsys Manufacturer | onsemi | Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
DS Breakdown Voltage-Min | 20 V | Drain Current-Max (ID) | 1.9 A |
Drain-source On Resistance-Max | 0.17 Ω | FET Technology | METAL-OXIDE SEMICONDUCTOR |
JESD-30 Code | R-PDSO-G6 | JESD-609 Code | e3 |
Moisture Sensitivity Level | 1 | Number of Elements | 2 |
Number of Terminals | 6 | Operating Mode | ENHANCEMENT MODE |
Operating Temperature-Max | 150 °C | Operating Temperature-Min | -55 °C |
Package Body Material | PLASTIC/EPOXY | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE | Peak Reflow Temperature (Cel) | 260 |
Polarity/Channel Type | P-CHANNEL | Qualification Status | Not Qualified |
Surface Mount | YES | Terminal Finish | MATTE TIN |
Terminal Form | GULL WING | Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 | Transistor Application | SWITCHING |
Transistor Element Material | SILICON |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The FDC6306P is a power management chip designed for portable devices. This chip integrates a battery charger, a linear regulator, a power switch, and an adjustable voltage detector into a single package, optimizing space and efficiency in electronic designs. It is suitable for applications like smartphones, tablets, and portable audio devices.
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Equivalent
The equivalent products of the FDC6306P chip are the FDC6305N and FDC6306N. These chips are similar in functionality and performance, making them suitable replacements for the FDC6306P in various applications. -
Features
The FDC6306P is a P-channel PowerTrench MOSFET with a low on-state resistance, high current rating, and low gate charge. It is designed for high efficiency power management applications such as DC-DC converters, power supplies, and battery protection circuits. It features a compact Power33 package for space-constrained designs. -
Pinout
The FDC6306P is a 6-channel electronic fuse with an integrated IC and power MOSFETs. It has 8 pins which include VCC, IN1-IN6, VOUT, and GND. The device provides overcurrent protection and fault indication for each channel, making it suitable for use in industrial and automotive applications. -
Manufacturer
The FDC6306P is a product manufactured by ON Semiconductor. ON Semiconductor is a global supplier of power management and analog semiconductor solutions. They specialize in creating energy-efficient and environmentally friendly products for a variety of industries including automotive, communication, and industrial applications. -
Application Field
The FDC6306P is popularly used in various applications such as liquid level sensing, proximity detection, flow rate monitoring, and touch sensing in consumer electronics, automotive, industrial automation, and medical devices. It is also used in white goods, home appliances, and household equipment for detecting the presence of liquid or objects. -
Package
The FDC6306P chip is available in a PowerVQFN-8 package type. Its form is Surface Mount and the size of the chip is 2mm x 2mm.
Oferecemos produtos de alta qualidade, serviço atencioso e garantia pós-venda
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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365 dias de garantia de qualidade para todos os produtos