Altera EP3C25F256I7
FPGA Cyclone® III Family 24624 Cells 437.5MHz 65nm Technology 1.2V 256-Pin FBGA
Marcas: Altera Corporation (Intel)
Parte do fabricante #: EP3C25F256I7
Ficha de dados: EP3C25F256I7 Ficha de dados (PDF)
Pacote/Caso: FBGA-256
Tipo de Produto: CIs lógicos programáveis
Status RoHS:
Condição de estoque: 2274 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Adicionar à lista técnicaEP3C25F256I7 Descrição geral
Cyclone® III Field Programmable Gate Array (FPGA) IC 156 608256 24624 256-LBGA
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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feature-family-name | Cyclone® III | feature-process-technology | 65nm |
feature-maximum-number-of-user-i-os | 156 | feature-number-of-registers | |
feature-device-logic-cells | 24624 | feature-device-system-gates | |
feature-number-of-multipliers | 66 (18x18) | feature-program-memory-type | SRAM |
feature-ram-bits-kbit | 594 | feature-total-number-of-block-ram | 66 |
feature-ethernet-macs | feature-supported-ip-core | 32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz|10 Gigabit Ethernet MAC|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|V1 ColdFire|Viterbi Compiler, Low-Speed/Hybrid Serial Decoder | |
feature-supported-ip-core-manufacture | Altera/Freescale/CAST, Inc/MorethanIP/PLDA | feature-maximum-number-of-serdes-channels | |
feature-device-logic-units | 24624 | feature-device-number-of-dlls-plls | 4 |
feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
feature-dedicated-dsp | feature-pci-blocks | ||
feature-programmability | No | feature-maximum-internal-frequency-mhz | 437.5 |
feature-speed-grade | 7 | feature-giga-multiply-accumulates-per-second | |
feature-differential-i-o-standards-supported | RSDS|SSTL-18|SSTL-2|HSTL-12|HSTL-15|HSTL-18|LVDS|LVPECL | feature-single-ended-i-o-standards-supported | HSTL|SSTL|PCI-X|PCI|LVCMOS|LVTTL |
feature-external-memory-interface | QDRII+SRAM|DDR2 SDRAM | feature-minimum-operating-supply-voltage-v | 1.15 |
feature-maximum-operating-supply-voltage-v | 1.25 | feature-packaging | |
feature-rohs | feature-rad-hard | ||
feature-pin-count | 256 | feature-supplier-package | FBGA |
feature-standard-package-name1 | BGA | feature-cecc-qualified | No |
feature-esd-protection | feature-escc-qualified | ||
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | 3A991 |
feature-svhc | Yes |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The EP3C25F256I7 chip is a member of the Cyclone III FPGA family by Altera. It features 25,000 logic elements, 256 kb embedded memory, and up to 622 I/O pins. This versatile chip is commonly used in a variety of applications including telecommunications, automotive, and industrial automation.
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Equivalent
Equivalent products of EP3C25F256I7 chip are EP3C16F256I7, EP3C40F256I7, and EP3C55F256I7. These chips are part of the Cyclone III family of FPGAs from Altera. They offer similar features and capabilities but with varying amounts of logic elements, memory, and other resources. -
Features
The EP3C25F256I7 is a Cyclone III FPGA with 25,000 logic elements, 256 Kbits of embedded memory, 312 user I/Os, and a 7-speed grade. It has a maximum operating frequency of 250 MHz and supports various interfaces such as DDR2, LVDS, and PCIe. -
Pinout
The EP3C25F256I7 is a Field Programmable Gate Array (FPGA) with a pin count of 256 pins. It has a variety of functions such as programmable logic cells, memory blocks, and digital signal processing. It is commonly used in telecommunications, automotive, and industrial applications. -
Manufacturer
The EP3C25F256I7 is manufactured by Intel Corporation, a multinational technology company known for producing a wide range of computer components and electronic devices. Intel is one of the largest semiconductor chip manufacturers in the world, specializing in the development of processors, memory chips, and other hardware components used in personal computers, servers, and other electronic devices. -
Application Field
The EP3C25F256I7 is commonly used in a variety of applications including telecommunications equipment, industrial automation, automotive systems, consumer electronics, and medical devices. It is well-suited for applications that require high performance, low power consumption, and programmability for custom functions. -
Package
The EP3C25F256I7 chip comes in a Ball Grid Array (BGA) package type, with a surface mount form, and dimensions of 17mm x 17mm.
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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365 dias de garantia de qualidade para todos os produtos