TI DRA821U4TGBALM

DRA821U4TGBALM Descrição geral

One of the standout features of the DRA821U4TGBALM is its support for ASIL-D and SIL 3 certification requirements, making it a reliable and secure choice for safety-critical applications. Real-time control and low-latency communication are enabled by a PCIe controller and a TSN capable Gigabit Ethernet switch, offering unparalleled performance and reliability

Características

Processor cores:

• Dual 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2.0 GHz, 24K DMIPS
  • 1MB L2 shared cache per dual-core Cortex-A72 cluster
  • 32KB L1 DCache and 48KB L1 ICache per A72 core
• 4× Arm Cortex-R5F MCUs at up to 1.0 GHz with optional lockstep operation, 8K DMIPS
  • 32K I-Cache, 32K D-Cache, 64K L2 TCM
  • 2× Arm Cortex-R5F MCUs in isolated MCU subsystem
  • 2× Arm Cortex-R5F MCUs in general compute partition

  Memory subsystem:

• 1MB of On-Chip L3 RAM with ECC and coherency
  • ECC error protection
  • Shared coherent cache
  • Supports internal DMA engine
• External Memory Interface (EMIF) module with ECC
  • Supports LPDDR4 memory types that comply with the JESD209-4B specification. (No support for byte mode LPDDR4 memories, or memories with more than 17 row address bits)
  • Supports speeds up to 3200 MT/s
  • 32-bit and 16-bit data bus with inline ECC bus up to 12.8GB/s
• General-Purpose Memory Controller (GPMC)
• 512KB on-chip SRAM in MAIN domain, protected by ECC

  Virtualization:

• Hypervisor support in Arm Cortex-A72
• Independent processing subsystems with Arm Cortex-A72, Arm Cortex-R5F with isolated safety MCU island
• IO virtualization support
  • Peripheral Virtualization Unit (PVU) for low latency high bandwidth peripheral traffic
• Multi-region firewall support for memory and peripheral isolation
• Virtualization support with Ethernet, PCIe, and DMA

• Device security (on select part numbers):

• Secure boot with secure runtime support
• Customer programmable root key, up to RSA-4K or ECC-512
• Embedded hardware security module
• Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES

  Functional Safety:

• Functional Safety-Compliant targeted (on select part numbers)
  • Developed for functional safety applications
  • Documentation will be available to aid ISO 26262 and IEC 61508 functional safety system design up to ASIL-D/SIL-3 targeted
  • Systematic capability up to ASIL-D/SIL-3 targeted
  • Hardware integrity up to ASIL-D/SIL-3 targeted for MCU Domain
  • Hardware integrity up to ASIL-D/SIL-3 targeted for Extended MCU (EMCU) portion of the Main Domain
  • Hardware integrity up to ASIL-B/SIL-2 targeted for remainder of the Main Domain
  • FFI isolation provided between EMCU and the remainder of the Main Domain
  • Safety-related certification
    • ISO 26262 and IEC 61508 planned
• AEC-Q100 qualified on part number variants ending in Q1

• High-speed interfaces:

  • Integrated Ethernet TSN/AVB switch supporting up to 4 (DRA821U4) or 2 (DRA821U2) external ports:
    • One port supports 5Gb, 10Gb USXGMII/XFI
    • All ports support 2.5Gb SGMII
    • All ports support 1Gb SGMII/RGMII
    • DRA821U4: Any single port can support QSGMII (using all 4 internal ports)
    • Non-blocking wire-rate store and forward switch
    • InterVLAN (Layer3) routing support
    • Time synchronization support with IEEE 1588(annex D,E,F)
    • TSN/AVB support for traffic scheduling, shaping
    • Port mirroring feature for debug and diagnostics
    • Policing and rate limiting support
  • One RGMII/RMII port in safety MCU island
• One PCI-Express Gen3 controller
  • Gen1, Gen2, and Gen3 operation with auto-negotiation
  • 4× lanes
• One USB 3.1 Gen1 dual-role device subsystem
  • Supports type-C switching
  • Independently configurable as USB host, USB peripheral, or USB dual-role device

  Automotive interfaces:

• Twenty CAN-FD ports
• 12× Universal Asynchronous Receiver/Transmitter (UART)
• 11× Serial Peripheral Interfaces (SPI)
• One 8-channel ADC
• 10× Inter-Integrated Circuit ( I2C™)
• 2× Improved Inter-Integrated Circuit ( I3C)

  Audio interfaces:

• 3× Multichannel Audio Serial Port (McASP) modules

  Flash memory interfaces:

• Embedded Multi Media Card ( eMMC™ 5.1) interface
  • Support speeds of up to HS400
• One Secure Digital 3.0/Secure Digital Input Output 3.0 (SD3.0/SDIO3.0) interfaces
• One Octal SPI / Xccela™ / HyperBus™ Memory Controller (HBMC) interface
• 16-nm FinFET technology
• 17.2 mm x 17.2 mm, 0.8 mm pitch, IPC Class 3 PCB

Especificações