Intel 5CSEMA6F31I7N

Part points

• The 5CSEMA6F31I7N chip is a field-programmable gate array (FPGA) device manufactured by Intel. It belongs to the Intel Cyclone V series and features a high-performance, low-power design. This chip is known for its versatility and can be used in a wide range of applications, including industrial automation, automotive electronics, communications, and more. It offers powerful processing capabilities and programmability, making it a popular choice for various FPGA-based projects.

• Equivalent

  The equivalent products of the 5CSEMA6F31I7N chip are other Field Programmable Gate Arrays (FPGAs) from Intel's Arria 10 family. These include the 5CSEMA6F31I7 variant and other models with similar features and capabilities offered by Intel.

• Features

  The features of the 5CSEMA6F31I7N include an Altera Cyclone V SoC (System on Chip) FPGA with 110,000 logic elements, dual-core ARM Cortex-A9 processor, 1.5 MB RAM, 31,680 adaptive logic modules, and 2,000 user I/Os. It supports a range of peripherals and interfaces for embedded system development.

• Pinout

  The 5CSEMA6F31I7N is a Cyclone V System on a Chip (SoC) FPGA with a pin count of 784. It integrates an ARM Cortex-A9 processor and offers various functions such as logic elements, transceivers, memory controllers, and interfaces for communication.

• Manufacturer

  The manufacturer of the 5CSEMA6F31I7N is Intel. Intel is an American multinational corporation that specializes in developing and manufacturing semiconductor chips and related technologies. They are one of the world's largest semiconductor chip manufacturers, supplying a wide range of products for various industries, including computer processors, network interface controllers, and integrated circuits.

• Application Field

  The 5CSEMA6F31I7N is an FPGA (Field-Programmable Gate Array) device, which can be used in a variety of application areas such as industrial automation, communications, automotive, defense, and aerospace. It provides programmable logic and processing capabilities, making it versatile for different applications and industries.

• Package

  The 5CSEMA6F31I7N chip comes in a Ball Grid Array (BGA) package type, with a form factor of FBGA-672. The package size of the chip is approximately 29mm x 29mm.