Altera 5AGXFB7K4F40I3N

Part points

• The 5AGXFB7K4F40I3N is a high-performance field programmable gate array (FPGA) chip from Intel. It features a large number of logic elements, high-speed transceivers, and low power consumption, making it suitable for a wide range of applications such as networking, telecommunications, and industrial automation. Its advanced architecture allows for complex designs to be implemented and easily reconfigured as needed.

• Equivalent

  Equivalent products of 5AGXFB7K4F40I3N chip are 5AGXFB7K4F40I3, 5AGXFB7K4F40I2, and 5AGXFB7K4F40I1. These are Altera Arria 5 GX FPGAs with 1.1 million logic elements, 1750 embedded multipliers, and up to 1240 user I/Os. They offer high performance and low power consumption for a variety of applications.

• Features

  The 5AGXFB7K4F40I3N is a high-performance FPGA (Field Programmable Gate Array) with a capacity of 99,648 logic elements, 6 Mbits of RAM, and 740 DSP blocks. It features integrated transceivers supporting data rates up to 3.75 Gbps, embedded flash memory, and support for advanced security features such as AES encryption.

• Pinout

  The 5AGXFB7K4F40I3N is a 40-pin FPGA (Field Programmable Gate Array) device. It is a high-performance component capable of implementing complex digital logic functions. The pin count and function vary depending on the specific implementation within a given application.

• Manufacturer

  The manufacturer of 5AGXFB7K4F40I3N is Intel. It is an American multinational corporation that designs and manufactures semiconductor chips and integrated circuits for a variety of devices, including computers, smartphones, and data centers. Intel is one of the largest and most well-known technology companies in the world.

• Application Field

  The 5AGXFB7K4F40I3N is a high-performance FPGA (Field-Programmable Gate Array) that can be used in a variety of applications such as industrial automation, automotive, communications, and aerospace. It is also suitable for image and signal processing, machine learning, and digital video processing due to its high-speed connectivity and processing capabilities.

• Package

  The 5AGXFB7K4F40I3N chip comes in a FBGA (Fine-pitch Ball Grid Array) package with a form factor of 40 mm x 40 mm and a size of 1517-ball.