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NXP XPC823EVR66B2

Microprocessors - MPU PB-FREE 823E 66MHZ

ISO14001 ISO9001 DUNS

Marcas: NXP

Parte do fabricante #: XPC823EVR66B2

Ficha de dados: XPC823EVR66B2 Ficha de dados (PDF)

Pacote/Caso: PBGA-256

Tipo de Produto: Microprocessors - MPU

Status RoHS:

Condição de estoque: 6554 peças, novo original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XPC823EVR66B2 Descrição geral

PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)

Características

  • The following list summarizes the key MPC860
  • features:
  • Embedded single-issue, 32-bit MPC8xx core (implementing the PowerPC architecture) with thirty-two 32-bit general-purpose registers (GPRs)
  • — The core performs branch prediction with conditional prefetch, without conditional execution
  • — 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1)
  • – 16-Kbyte instruction caches are four-way, set-associative with 256 sets;
  • 4-Kbyte instruction caches are two-way, set-associative with 128 sets.
  • – 8-Kbyte data caches are two-way, set-associative with 256 sets; 4-Kbyte data caches are two-way, set-associative with 128 sets.
  • – Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache blocks.
  • – Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and are lockable on a cache block basis.
  • — Instruction and data caches are two-way, set-associative, physically addressed, LRU replacement, and lockable on-line granularity.
  • — MMUs with 32-entry TLB, fully associative instruction, and data TLBs
  • — MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address spaces and 16 protection groups
  • — Advanced on-chip-emulation debug mode
  • Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
  • 32 address lines
  • Operates at up to 80 MHz
  • Memory controller (eight banks)
  • — Contains complete dynamic RAM (DRAM) controller
  • — Each bank can be a chip select or RASto support a DRAM bank
  • — Up to 15 wait states programmable per memory bank
  • — Glueless interface to DRAM, SIMMS, SRAM, EPROM, Flash EPROM, and other memory devices.
  • — DRAM controller programmable to support most size and speed memory interfaces
  • — Four CASlines, four WElines, one OEline
  • — Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory)
  • — Variable block sizes (32 Kbyte to 256 Mbyte)
  • — Selectable write protection
  • — On-chip bus arbitration logic
  • General-purpose timers
  • — Four 16-bit timers or two 32-bit timers
  • — Gate mode can enable/disable counting
  • — Interrupt can be masked on reference match and event capture
  • System integration unit (SIU)
  • — Bus monitor
  • — Software watchdog
  • — Periodic interrupt timer (PIT)
  • — Low-power stop mode
  • — Clock synthesizer
  • — Three parallel I/O registers with open-drain capability
  • Four baud-rate generators (BRGs)
  • — Independent (can be connected to any SCC or SMC)
  • — Allow changes during operation
  • — Autobaud support option
  • Four serial communications controllers (SCCs)
  • — Ethernet/IEEE 802.3 optional on SCC1–4, supporting full 10-Mbps operation (available only on specially programmed devices).
  • — HDLC/SDLC(all channels supported at 2 Mbps)
  • — HDLC bus (implements an HDLC-based local area network (LAN))
  • — Asynchronous HDLC to support PPP (point-to-point protocol)
  • — AppleTalk
  • — Universal asynchronous receiver transmitter (UART)
  • — Synchronous UART
  • — Serial infrared (IrDA)
  • — Binary synchronous communication (BISYNC)
  • — Totally transparent (bit streams)
  • — Totally transparent (frame based with optional cyclic redundancy check (CRC))
  • Two SMCs (serial management channels)
  • — UART
  • — Transparent
  • — General circuit interface (GCI) controller
  • — Can be connected to the time-division multiplexed (TDM) channels
  • One SPI (serial peripheral interface)
  • — Supports master and slave modes
  • — Supports multimaster operation on the same bus
  • One I2C (inter-integrated circuit) port
  • — Supports master and slave modes
  • — Multiple-master environment support
  • Time-slot assigner (TSA)
  • — Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation
  • — Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined
  • — 1- or 8-bit resolution
  • — Allows independent transmit and receive routing, frame synchronization, clocking
  • — Allows dynamic changes
  • — Can be internally connected to six serial channels (four SCCs and two SMCs)
  • Parallel interface port (PIP)
  • — Centronics interface support
  • — Supports fast connection between compatible ports on the MPC860 or the MC68360
  • PCMCIA interface
  • — Master (socket) interface, release 2.1 compliant
  • — Supports two independent PCMCIA sockets
  • — Eight memory or I/O windows supported
  • Low power support
  • — Full on—all units fully powered
  • — Doze—core functional units disabled, except time base decrementer, PLL, memory controller, RTC, and CPM in low-power standby
  • — Sleep—all units disabled, except RTC and PIT, PLL active for fast wake up
  • — Deep sleep—all units disabled including PLL, except RTC and PIT
  • — Power down mode— all units powered down, except PLL, RTC, PIT, time base, and decrementer
  • Debug interface
  • — Eight comparators: four operate on instruction address, two operate on data address, and two operate on data
  • — Supports conditions: =≠<>
  • — Each watchpoint can generate a break-point internally
  • 3.3 V operation with 5-V TTL compatibility except EXTAL and EXTCLK
  • 357-pin ball grid array (BGA) package

Especificações

Parâmetro Valor Parâmetro Valor
Manufacturer NXP Product Category Microprocessors - MPU
Mounting Style SMD/SMT Package / Case PBGA-256
Core PowerPC Number of Cores 1 Core
Data Bus Width 32 bit Maximum Clock Frequency 66 MHz
L1 Cache Instruction Memory 2 kB L1 Cache Data Memory 1 kB
Operating Supply Voltage 3.3 V Minimum Operating Temperature 0 C
Maximum Operating Temperature + 95 C Brand NXP Semiconductors
Data RAM Size 8 kB I/O Voltage 3.3 V
Interface Type Ethernet, I2C, UART, USB Memory Type L1 Cache, RAM
Number of Timers/Counters 4 Timer Processor Series PowerPC
Product Type Microprocessors - MPU Subcategory Microprocessors - MPU
Watchdog Timers Watchdog Timer

Envio

Tipo de envio Taxa de envio Tempo de espera
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 dias
Fedex FedEx $20.00-$40.00 (0.50 KG) 2-5 dias
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 dias
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 dias
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 dias
CORREIO AÉREO REGISTADO CORREIO AÉREO REGISTADO $20.00-$40.00 (0.50 KG) 2-5 dias

Tempo de processamento: A taxa de envio depende de diferentes zonas e países.

Pagamento

Termos de pagamento Taxa de mão
Transferência bancária Transferência bancária cobrar taxa bancária de US$ 30,00.
PayPal PayPal cobrar taxa de serviço de 4,0%.
Cartão de crédito Cartão de crédito cobrar taxa de serviço de 3,5%.
Western Union Western Union charge US.00 banking fee.
Grama de dinheiro Grama de dinheiro cobrar taxa bancária de US$ 0,00.

Garantias

1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.

2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.

Embalagem

  • produtos

    Etapa1 :produtos

  • Embalagem a vácuo

    Etapa2 :Embalagem a vácuo

  • Saco antiestático

    Etapa3 :Saco antiestático

  • Embalagem individual

    Etapa4 :Embalagem individual

  • Caixas de embalagem

    Etapa5 :Caixas de embalagem

  • etiqueta de envio com código de barras

    Etapa6 :etiqueta de envio com código de barras

Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.

Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.

Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.

Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.

  • ESD
  • ESD

Part points

  • The XPC823EVR66B2 chip is a microprocessor chip manufactured by Motorola. It is part of the PowerPC 8xx family and is used in embedded systems. The chip has a clock speed of 66 MHz and features a PowerPC 603e core. It also includes various integrated peripherals, such as memory controllers and communication interfaces, making it suitable for a range of applications in industrial automation, telecommunications, and automotive sectors.
  • Features

    The XPC823EVR66B2 is a microprocessor from the PowerPC 823 family. It has a clock speed of 66 MHz and is designed for embedded applications. It features a 32-bit RISC architecture, a FPU, multiple communication interfaces, and a variety of peripherals.
  • Pinout

    The XPC823EVR66B2 has 196 pins. Its functions include a 66 MHz PowerPC processor, memory controllers, peripheral interfaces (such as UART, I2C, SPI), and various input/output pins for connectivity with other devices.
  • Manufacturer

    The manufacturer of the XPC823EVR66B2 is IBM. IBM is an American multinational technology company that specializes in computer hardware, software, and IT consulting services. Founded in 1911, IBM is one of the world's leading manufacturers of computer systems and components and is known for its innovation and development of advanced technologies.
  • Application Field

    The XPC823EVR66B2 is a microprocessor that can be used in various application areas, including industrial automation, telecommunications, automotive, and consumer electronics. It offers advanced features like high-speed processing, low power consumption, and support for multiple interfaces, making it suitable for a wide range of embedded systems.
  • Package

    The XPC823EVR66B2 chip has a package type of 360-pin BGA, a form factor of 13x13 mm, and a size of approximately 169 mm^2.

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  • quantity

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    A menor taxa de envio internacional começa em US$ 0,00

  • garantia

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