XCZU9CG-1FFVC900I

Part points

• The XCZU9CG-1FFVC900I is a high-performance system on chip (SoC) from Xilinx's Zynq UltraScale+ family. It combines a quad-core ARM Cortex-A53 processor with a dual-core Cortex-R5 real-time processor and an advanced FPGA fabric. It is designed for applications that require high processing and programmable logic capabilities, such as aerospace and defense, automotive, and industrial automation.

• Equivalent

  Some equivalent products of XCZU9CG-1FFVC900I chip are XCZU9EG-1FFVB1156E, XCZU9EG-1FFVC900E, and XCZU7EG-2FFVC900I. These chips belong to the same family of Zynq UltraScale+ MPSoC devices, and have similar features and capabilities, making them potential substitutes for each other in certain applications.

• Features

  The XCZU9CG-1FFVC900I is a Zynq UltraScale+ MPSoC device from Xilinx that features a quad-core ARM Cortex-A53, dual-core ARM Cortex-R5, and a Mali-400 MP2 GPU. It also includes programmable logic with 600K logic cells, 2.4M system logic cells, 11.5 GB/s memory bandwidth, and multiple multimedia and connectivity interfaces.

• Pinout

  The XCZU9CG-1FFVC900I is a Zynq UltraScale+ MPSoC with a pin count of 900. It integrates a quad-core ARM Cortex-A53 and dual-core Cortex-R5, as well as programmable logic for custom hardware acceleration. Its primary functions include high-performance processing, real-time control, and reconfigurable hardware acceleration.

• Manufacturer

  The XCZU9CG-1FFVC900I is manufactured by Xilinx, Inc. Xilinx is an American technology company that specializes in the development and manufacturing of field-programmable gate array (FPGA) and programmable logic devices. They offer a range of products for various industries such as automotive, aerospace, defense, and telecommunications.

• Application Field

  The XCZU9CG-1FFVC900I is a highly versatile system on chip (SoC) that is commonly used in applications such as industrial automation, automotive driver assistance systems, aerospace and defense, and telecommunications. Its combination of high performance processing, programmable logic, and integrated connectivity make it well-suited for a wide range of applications.

• Package

  The XCZU9CG-1FFVC900I chip is a flip-chip ball grid array (FCBGA) package type with a 35 mm x 35 mm size and 900-pin count. It is in the 900-pin fine-pitch ball grid array (FFVC900) form.