Xilinx XCF02S

Part points

• XCF02S is a non-volatile configuration memory device commonly used in FPGA programming. It offers a 2Mb capacity and fast programming speeds, making it ideal for storing configuration data in embedded systems. The XCF02S chip provides reliable performance and easy integration into various electronic designs.

• Equivalent

  Some equivalent products of the XCF02S chip include the XCF04S, XCF08S, and XCF16S. These chips all offer similar features and functionality, providing customers with a range of options to suit their specific needs and requirements in terms of configuration memory devices.

• Features

  XCF02S is a high-speed, low-power serial configuration device with a Advanced Sector Protection, low standby current and full read and program fast erase operations. It offers flexible 2x, 4x, and 8x I/O and multiple device ratio configurations. It also has an industry-standard 10-pin or 16-pin Surface Mount device package.

• Pinout

  The XCF02S has a pin count of 8. It is a 2 Mb (256K x 8), 3.3V in-system programmable configuration PROM for CPLDs. The device offers cost-effective configuration for parallel NOR flash architectures. Please refer to the datasheet for more detailed information.

• Manufacturer

  The XCF02S is manufactured by Xilinx, a leading American provider of programmable logic devices and software tools. Xilinx is a semiconductor company specializing in the development of field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs) for various industries such as telecommunications, automotive, aerospace, and consumer electronics.

• Application Field

  The XCF02S is commonly used in applications such as automotive, telecommunications, industrial controls, medical devices, and military/aerospace systems. It is suitable for storing configuration data, firmware, and parameters in these industries due to its non-volatile memory, high reliability, and low power consumption.

• Package

  The XCF02S chip is available in a 8-SOIC package type, with a surface mount form. It has a size of 3.90mm x 4.90mm and can be easily soldered onto a PCB for integration into electronic devices.