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$5000XC7Z100-2FFG900I
Cortex-A9 800MHz embedded system-on-chip with 900FCBGA packaging
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Marcas: Amd
Parte do fabricante #: XC7Z100-2FFG900I
Ficha de dados: XC7Z100-2FFG900I Ficha de dados (PDF)
Pacote/Caso: FBGA-900
Tipo de Produto: System On Chip (SoC)
Status RoHS:
Condição de estoque: 6.554 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC7Z100-2FFG900I Descrição geral
Meet the XC7Z100-2FFG900I, a powerhouse of a product from the Zynq Family 7000 Series Microprocessors. Boasting an impressive 800Mhz CPU speed and an Arm Cortex-A9 core architecture, this product is built to handle even the most demanding tasks with ease. Its FCBGA package with 900 pins ensures a secure and reliable connection, making it suitable for a wide range of applications. And to top it off, it is RoHS compliant, making it a responsible choice for environmentally conscious users
Características
- This Zynq-7000 series SoC features advanced power management capabilities for reduced energy consumption
- Packed with multiple I/O interfaces including PCIe, Gigabit Ethernet, and USB
- Designed for high-performance embedded systems development applications
Aplicativo
- Advanced technology for aerospace industry
- Efficient for industrial automation
- Enhanced processing capabilities
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Product Category | SoC FPGA | RoHS | Details |
Mounting Style | SMD/SMT | Package / Case | FBGA-900 |
Core | ARM Cortex A9 | Number of Cores | 2 Core |
Maximum Clock Frequency | 766 MHz | L1 Cache Instruction Memory | 2 x 32 kB |
L1 Cache Data Memory | 2 x 32 kB | Number of Logic Elements | 444000 LE |
Adaptive Logic Modules - ALMs | 69350 ALM | Embedded Memory | 26.5 Mbit |
Number of I/Os | 362 I/O | Minimum Operating Temperature | - 40 C |
Maximum Operating Temperature | + 100 C | Brand | AMD / Xilinx |
Moisture Sensitive | Yes | Number of Logic Array Blocks - LABs | 34675 LAB |
Product Type | Processors - Application Specialized | Series | XC7Z100 |
Factory Pack Quantity | 1 | Subcategory | SOC - Systems on a Chip |
Tradename | Zynq |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XC7Z100-2FFG900I is a high-performance system-on-chip (SoC) from Xilinx, featuring a dual-core ARM Cortex-A9 processor and programmable logic in a single device. It offers a wide range of features and peripherals for applications in communications, industrial automation, and automotive industries.
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Equivalent
Some equivalent products of the XC7Z100-2FFG900I chip include the XC7Z100-2FFG900C and XC7Z100-2FFG900I models from Xilinx, as well as the Altera Arria 10 GX 1150 and Intel Stratix 10 GX 1150 chips. These chips have similar capabilities and features, making them suitable replacements for the XC7Z100-2FFG900I. -
Features
1. Dual-core ARM Cortex-A9 processor 2. 1.0 GHZ clock speed 3. 28nm technology 4. Programmable logic with 101440 LUTs 5. 525Kb BRAM 6. 855 DSP slices 7. 6.6Mb of block RAM 8. 1Gbps Ethernet MACs 9. Advanced memory controller 10. PCI Express Gen2 endpoint host/device ports. -
Pinout
XC7Z100-2FFG900I is a Xilinx Zynq-7000 series SoC with 900-pin FFG package. It features 155K logic cells, 6.9Mb RAM, 360 DSP slices, and dual ARM Cortex-A9 processors. The pin count consists of power/gnd pins, configuration pins, I/O pins, and dedicated interfaces for peripherals like UART, SPI, I2C, GPIO, Ethernet, and PCIe. -
Manufacturer
The XC7Z100-2FFG900I is manufactured by Xilinx, which is a leading American company specializing in the design and development of field-programmable gate arrays (FPGAs) and programmable logic devices. Xilinx provides innovative programmable solutions for a wide range of applications in industries such as telecommunications, automotive, industrial, and aerospace. -
Application Field
The XC7Z100-2FFG900I is commonly used in applications such as automotive, industrial automation, aerospace, and defense due to its high performance capabilities and flexibility. It is also utilized in medical imaging, telecommunications, and video processing applications that require advanced signal processing and data processing capabilities. -
Package
The XC7Z100-2FFG900I chip is packaged in a ball grid array (BGA) form with a size of 35 mm x 35 mm.
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A quantidade mínima de pedido começa em 1 unidade.
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