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$5000XC7Z030-2FBG676E
IC system on a chip with Cortex-A9 processor running at 800MHz in a 676-pin BGA package
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Marcas: Amd
Parte do fabricante #: XC7Z030-2FBG676E
Ficha de dados: XC7Z030-2FBG676E Ficha de dados (PDF)
Pacote/Caso: FCBGA-676
Tipo de Produto: System On Chip (SoC)
Status RoHS:
Condição de estoque: 6.367 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC7Z030-2FBG676E Descrição geral
Featuring the Arm Cortex-A9 core architecture, the XC7Z030-2FBG676E offers exceptional processing power for demanding applications. With a CPU speed of 800Mhz and 676 pins in an Fcbga package, this microprocessor is well-suited for automotive and industrial use. As part of the Zynq 7000 series, it delivers the performance and reliability required for critical systems. The XC7Z030-2FBG676E is designed to meet the stringent RoHS requirements, ensuring it is environmentally friendly and compliant with industry standards
Características
- Suitable for robotics, automation, and IoT applications
- Dual-core processor with low power consumption
- Integrated SATA connectivity for storage devices
- High-speed data transfer up to 3 Gbps
- On-chip memory up to 256KB for fast access
Aplicativo
- Smart meters
- RFID tags
- Logic analyzers
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Product Category | SoC FPGA | RoHS | Details |
Mounting Style | SMD/SMT | Package / Case | FCBGA-676 |
Core | ARM Cortex A9 | Number of Cores | 2 Core |
Maximum Clock Frequency | 766 MHz | L1 Cache Instruction Memory | 2 x 32 kB |
L1 Cache Data Memory | 2 x 32 kB | Number of Logic Elements | 125000 LE |
Adaptive Logic Modules - ALMs | 19650 ALM | Embedded Memory | 9.3 Mbit |
Number of I/Os | 250 I/O | Minimum Operating Temperature | 0 C |
Maximum Operating Temperature | + 100 C | Brand | AMD / Xilinx |
Moisture Sensitive | Yes | Number of Logic Array Blocks - LABs | 9825 LAB |
Product Type | Processors - Application Specialized | Series | XC7Z030 |
Factory Pack Quantity | 1 | Subcategory | SOC - Systems on a Chip |
Tradename | Zynq |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
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CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
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Transferência bancária | cobrar taxa bancária de US$ 30,00. |
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PayPal | cobrar taxa de serviço de 4,0%. |
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Cartão de crédito | cobrar taxa de serviço de 3,5%. |
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Western Union | charge US.00 banking fee. |
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Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The XC7Z030-2FBG676E is a system-on-chip (SoC) device from Xilinx, featuring a dual-core ARM Cortex-A9 processor alongside programmable logic for customizable hardware acceleration. With a capacity for high-performance computing and integrated interfaces, this chip is commonly used in embedded systems, industrial automation, and communications applications.
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Equivalent
Some of the equivalent products of XC7Z030-2FBG676E chip include XC7Z030-3FFG676I, XC7Z030-1FFG676I, and XC7Z030-2FBG485VG. These chips are part of the Xilinx Zynq-7000 family of SoCs and offer similar features and capabilities. -
Features
XC7Z030-2FBG676E is a Xilinx Zynq-7000 SoC combines a dual-core ARM Cortex-A9 processor with a programmable logic fabric, providing high-performance processing capabilities and FPGA flexibility. It features 85K logic cells, 32.5 Mb BRAM, 220 DSP slices, PCIe, Gigabit Ethernet, USB, and supports industrial temperature range. -
Pinout
The XC7Z030-2FBG676E is a 676-pin Ball Grid Array (BGA) package system-on-chip from Xilinx. It features a dual-core ARM Cortex-A9 processor with a programmable logic fabric, making it suitable for various embedded applications requiring high processing power and flexibility. -
Manufacturer
The XC7Z030-2FBG676E is manufactured by Xilinx, which is a multinational semiconductor company known for designing and developing programmable devices. Xilinx specializes in the production of field-programmable gate array (FPGA) and programmable logic devices for a wide range of applications in industries such as aerospace, automotive, telecommunications, and data centers. -
Application Field
The XC7Z030-2FBG676E is commonly used in applications such as industrial automation, automotive systems, medical equipment, and aerospace. Its high performance and versatility make it suitable for a wide range of applications requiring real-time processing, high-speed connectivity, and advanced signal processing capabilities. -
Package
The XC7Z030-2FBG676E chip is in a Ball Grid Array (BGA) package, has 676 pins, and is a form of a system-on-chip (SoC). It has a size of 17x17 mm.
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