Xilinx XC3SD3400A-4FG676I

Part points

• The XC3SD3400A-4FG676I chip is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It belongs to the Spartan-3A family and has 3,400 slices, 422Kbits of RAM, 181 I/Os, and a core frequency of up to 350MHz. It is widely used in various applications, including telecommunications, automotive, industrial automation, and consumer electronics, due to its high performance and flexibility in digital circuit design.

• Features

  XC3SD3400A-4FG676I is a field-programmable gate array (FPGA) by Xilinx. It has 3,400K system gates, 21,840 slices, and 1,679KB of memory. It operates at a maximum frequency of 320MHz and supports various I/O standards. The FPGA is targeted at applications requiring high-performance and high-capacity programmable logic solutions.

• Pinout

  The XC3SD3400A-4FG676I is a Field Programmable Gate Array (FPGA) with a pin count of 676. It is used for advanced digital design and prototyping and offers various functions, including flexible logic and routing capabilities, high-performance processing, and integrated programmable I/O interfaces.

• Manufacturer

  The manufacturer of the XC3SD3400A-4FG676I is Xilinx. Xilinx is a leading semiconductor company specializing in field-programmable gate arrays (FPGAs) and programmable logic devices (PLDs). They design and manufacture integrated circuits that can be reprogrammed by customers, allowing for flexibility in hardware design and functionality.

• Application Field

  The XC3SD3400A-4FG676I FPGA can be used in a range of applications, including digital signal processing, high-performance computing, advanced communication systems, automotive electronics, and industrial automation. It offers high logic capacity, high-speed performance, and flexibility making it suitable for a wide array of sophisticated applications.

• Package

  The XC3SD3400A-4FG676I chip is available in a FG676 package type, which refers to a fine-pitch ball grid array (BGA) package. The form of the chip is a BGA, and the dimensions of this package size are 27mm x 27mm, with a 1mm ball pitch.