Xilinx XC3S700A-4FTG256I

Part points

• The XC3S700A-4FTG256I is a Field Programmable Gate Array (FPGA) chip produced by Xilinx. It offers 700,000 programmable logic cells and a range of configurable features, making it suitable for a variety of applications such as digital signal processing, high-speed communication, and embedded systems. The chip is part of the Spartan-3A family and is known for its flexibility, low power consumption, and cost-effectiveness.

• Equivalent

  XC3S700A-4FTG256I is a model of the Xilinx Spartan-3A field-programmable gate array (FPGA) family. There are no direct equivalent products as each model has its own unique specifications and features. However, the Spartan-3A family includes various other models with similar capabilities but different configuration options.

• Features

  The XC3S700A-4FTG256I is an FPGA (Field Programmable Gate Array) from Xilinx. It has 700,000 system gates, operates at a speed grade of -4, and comes in a FTG256 package. This FPGA offers advanced programmability, versatility, and reliability for various applications such as digital signal processing, networking, and system integration.

• Pinout

  The XC3S700A-4FTG256I is a 256-ball, 700K gate (logic cells) FPGA (Field Programmable Gate Array) with a pin count of 256. It provides electronic circuitry for programmable logic. Each pin has a specific function, such as input, output, or control, which is determined by the designer during programming.

• Manufacturer

  XC3S700A-4FTG256I is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. Xilinx is a leading American semiconductor company specializing in programmable logic devices and related technology. They are known for their FPGA chips, which allow users to customize digital circuits, making them suitable for a wide range of applications in various industries such as telecom, automotive, and aerospace.

• Application Field

  The XC3S700A-4FTG256I FPGA chip is commonly used in various applications such as telecommunications, automotive systems, medical devices, industrial automation, and consumer electronics. Its high performance, low power consumption, and flexible design make it suitable for a wide range of applications requiring complex digital signal processing, data processing, and control functions.

• Package

  The XC3S700A-4FTG256I chip has a Fine-Pitch Ball Grid Array (FBGA) package type, with 256 pins in a Grid Array form, and a Compact size.