Xilinx XC3S500E-5FTG256C

Part points

• The XC3S500E-5FTG256C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-3E FPGA family and is available in the FT256 package. The chip offers 500,000 system gates and 7,292 logic cells, making it suitable for various applications such as digital signal processing, automotive electronics, and industrial automation.

• Equivalent

  Some equivalent products to the XC3S500E-5FTG256C chip include the XC3S500E-4FGG320C, XC3S500E-4FTG256I, XC3S500E-5FTG256I, and the XC3S500E-4FGG320I. These chips are all within the same family and have similar specifications and functionalities.

• Features

  XC3S500E-5FTG256C is a field-programmable gate array (FPGA) device with 500K System Gates, 17176 Logic Cells, and 360 User I/Os. It features high-performance, low-power consumption, and reliable performance. It operates on a 5V power supply and has a 256-ball fine-pitch BGA package. It is designed for applications requiring high-speed, real-time processing capabilities.

• Pinout

  The XC3S500E-5FTG256C is a Field-Programmable Gate Array (FPGA) with a pin count of 256. The pins serve various functions like input/output connections, power supply, configuration, clock signals, and control signals. These pins allow the user to configure the FPGA and implement desired digital logic circuits and functionalities.

• Manufacturer

  The manufacturer of the XC3S500E-5FTG256C is Xilinx Inc. It is a leading American technology company specializing in the design and development of programmable logic devices and associated technologies.

• Application Field

  The XC3S500E-5FTG256C is an FPGA (Field Programmable Gate Array) device. It can be used in a variety of application areas including telecommunications, industrial automation, medical devices, aerospace and defense systems, and consumer electronics. Its flexibility, high performance, and reprogrammability make it suitable for a wide range of applications.

• Package

  The XC3S500E-5FTG256C chip is available in a 256-ball grid array (BGA) package type. It has a total size of 17x17 mm (256 square mm) and conforms to the Enhanced BGA package form.