Xilinx XC3S500E-4VQG100I

Part points

• The XC3S500E-4VQG100I is a Field-Programmable Gate Array (FPGA) chip manufactured by Xilinx. It has a capacity of 500,000 system gates and is designed for a wide range of applications. It offers high performance, low power consumption, and flexibility. The chip's features include configurable logic blocks, block RAM, input/output pins, and various connectivity options, making it suitable for implementing complex digital systems.

• Equivalent

  Some equivalent products of the XC3S500E-4VQG100I chip are Xilinix XC3S500E-4FG320C, Xilinx XC3S500E-4FT256C, and Xilinx XC3S500E-100-4VQG100C. These are all variations or alternative options within the same family of FPGAs, providing similar functionality and capabilities.

• Features

  The XC3S500E-4VQG100I is an FPGA (Field-Programmable Gate Array) with 500,000 system gates, 192 user I/Os, 16,640 logic cells, and a maximum operating frequency of 400 MHz. It has advanced features like high-speed differential I/Os, dynamic reconfiguration, and built-in hardware accelerators. It offers a wide range of connectivity options and is ideal for demanding applications that require high-performance and flexibility.

• Pinout

  The XC3S500E-4VQG100I is a Field-Programmable Gate Array (FPGA) with a pin count of 100 and operates with a voltage of 4V. It is based on the Spartan-3E family and offers 500,000 system gates.

• Manufacturer

  XC3S500E-4VQG100I is manufactured by Xilinx Inc., which is a leading company in the field of programmable logic devices and semiconductor solutions. Xilinx specializes in the development and production of field-programmable gate arrays (FPGAs) and related technologies. They provide innovative solutions for a wide range of industries including aerospace, automotive, telecommunications, and data centers.

• Application Field

  The XC3S500E-4VQG100I is a field-programmable gate array (FPGA) used in various industrial applications, including aerospace and defense, automotive, telecommunications, and medical devices. It is commonly used for data processing, signal processing, and system control in these industries.

• Package

  The XC3S500E-4VQG100I chip has a VQG100 package type, a form factor of QFP (Quad Flat Package), and a size of 10mm x 10mm.