Xilinx XC3S400-4FG456C

Part points

• The XC3S400-4FG456C chip is a Field-Programmable Gate Array (FPGA) produced by Xilinx. It features 400K system gates and is manufactured using a 90nm process technology. The chip is designed to provide programmable logic functions and high-performance processing capabilities for a wide range of applications, including telecommunications, video processing, and industrial control systems.

• Equivalent

  Equivalent products of the XC3S400-4FG456C chip are the XC3S400-4PQ208C, XC3S400-4TQG144C, and XC3S400-4FTG256C.

• Features

  The XC3S400-4FG456C is an FPGA device that features 400K system gates, 1,620 slice flip-flops, 18,432 logic cells, and 166 user I/Os. It operates at a maximum speed of 550 MHz and is designed for applications in the fields of automotive, consumer electronics, telecommunications, and more.

• Pinout

  The XC3S400-4FG456C is an FPGA (Field Programmable Gate Array) with a pin count of 456. It offers programmable logic cells, block RAM, and DSP slices, making it suitable for various applications, such as data processing and control systems.

• Manufacturer

  The XC3S400-4FG456C is manufactured by Xilinx, Inc. Xilinx is a multinational technology company specialized in the design and creation of programmable logic devices, particularly field-programmable gate arrays (FPGAs). They provide solutions for various industries, including aerospace, defense, automotive, telecommunications, and more.

• Application Field

  The XC3S400-4FG456C is a field-programmable gate array (FPGA) that can be used in a variety of applications such as aerospace and defense systems, automotive electronics, industrial automation, communications equipment, and medical devices. It offers high-performance logic, memory, and I/O capabilities, making it suitable for a wide range of embedded system designs.

• Package

  The package type of the XC3S400-4FG456C chip is FG456. The form of the chip is BGA. The size of the chip is 17 mm x 17 mm.