W25Q32FVSSIQ

Part points

• W25Q32FVSSIQ is a flash memory chip manufactured by Winbond. It has a capacity of 32 megabits (4 megabytes) and operates on a 3V power supply. The chip uses a SPI (Serial Peripheral Interface) for communication and offers fast read and write speeds. It is commonly used in various electronic devices for data storage and code execution purposes.

• Equivalent

  Some equivalent products of the W25Q32FVSSIQ chip are the MX25L3233F, S25FL032P, and the EN25Q32B.

• Features

  The W25Q32FVSSIQ is a 32Mbit flash memory with Quad SPI interface. It offers a wide operating voltage range, fast read and write speeds, and low power consumption. With its small form factor and high data transfer rates, it is suitable for various applications such as automotive, industrial, and consumer electronics.

• Pinout

  The W25Q32FVSSIQ is a flash memory chip with an 8-pin package. Its pins serve the following functions: GND (Ground), CS (Chip Select), DO (Data Output), WP (Write Protect), W (Write Enable), DI (Data Input), CLK (Clock), and VCC (Power Supply).

• Manufacturer

  The W25Q32FVSSIQ is manufactured by Winbond Electronics, a Taiwanese semiconductor company specializing in memory solutions.

• Application Field

  The W25Q32FVSSIQ is a flash memory chip commonly used in various electronic devices such as smartphones, tablets, laptops, and gaming consoles for storing data. It is also employed in automotive systems, industrial equipment, and medical devices to store firmware, configuration settings, and log data.

• Package

  The W25Q32FVSSIQ chip package type is SOP (Small Outline Package), the form is 8-SOIC (8 leads, Small Outline Integrated Circuit), and the size is 208mil (0.5mm pitch).