TI UCC27201DR
Half-Bridge Gate Driver IC Non-Inverting 8-SOIC
Marcas: TI
Parte do fabricante #: UCC27201DR
Ficha de dados: UCC27201DR Ficha de dados (PDF)
Pacote/Caso: SOIC-8
Status RoHS:
Condição de estoque: 5000 peças, novo original
Tipo de Produto: MOSFET & Power Driver ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*Todos os preços estão em USD
Quantidade | Preço unitário | Preço Externo |
---|---|---|
1 | $1,369 | $1,369 |
10 | $1,248 | $12,480 |
30 | $1,170 | $35,100 |
100 | $1,091 | $109,100 |
500 | $0,957 | $478,500 |
1000 | $0,944 | $944,000 |
In Stock:5000 PCS
UCC27201DR Descrição geral
The UCC2720x family of high-frequency N-channel MOSFET drivers include a 120-V bootstrap diode and high-side and low-side drivers with independent inputs for maximum control flexibility. This allows for N-channel MOSFET control in half-bridge, full-bridge, two-switch forward, and active clamp forward converters. The low-side and the high-side gate drivers are independently controlled and matched to 1 ns between the turnon and turnoff of each other.
An on-chip bootstrap diode eliminates the external discrete diodes. Undervoltage lockout is provided for both the high-side and the low-side drivers forcing the outputs low if the drive voltage is below the specified threshold.
Two versions of the UCC27200 are offered. The UCC27200 has high noise immune CMOS input thresholds while the UCC27201 has TTL compatible thresholds.
Características
- Drives Two N-Channel MOSFETs in High-Side
and Low-Side Configuration - Negative Voltage Handling on HS (–5 V)
- Maximum Boot Voltage of 120 V
- Maximum VDD Voltage of 20 V
- On-Chip 0.65-V VF, 0.6-Ω RD Bootstrap Diode
- Greater than 1 MHz of Operation
- 20-ns Propagation Delay Times
- 3-A Sink and 3-A Source Output Currents
- 8-ns Rise and 7-ns Fall Time With 1000-pF Load
- 1-ns Delay Matching
- Undervoltage Lockout for High-Side and Low-Side
Driver - Specified from –40°C to 140°C
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Bus voltage (max) (V) | 110 | Power switch | MOSFET |
Input VCC (min) (V) | 8 | Input VCC (max) (V) | 17 |
Peak output current (A) | 3 | Operating temperature range (°C) | -40 to 140 |
Undervoltage lockout (typ) (V) | 8 | Rating | Catalog |
Propagation delay time (µs) | 0.02 | Rise time (ns) | 8 |
Fall time (ns) | 7 | Iq (mA) | 0.001 |
Input threshold | TTL | Channel input logic | TTL |
Negative voltage handling at HS pin (V) | -5 |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The UCC27201DR chip is a dual-channel high-speed, low-side gate driver designed to drive power MOSFETs or IGBTs in a half-bridge or full-bridge configuration for power conversion applications. It features independently controlled channels, low propagation delay, and adjustable dead time to maximize efficiency and reliability in high-frequency switching circuits.
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Equivalent
TI offers the UCC27201DR chip as part of the UCC27201 product family. Equivalent products include UCC27201A, UCC27201B, UCC27201C, and UCC27201P, which have similar features and performance characteristics for driving power MOSFETs in high-power applications. -
Features
The UCC27201DR is a high-speed, dual-channel gate driver designed for driving MOSFETs and IGBTs in high-power applications. It features a wide input voltage range, adjustable dead time, and overcurrent protection. Additionally, it has a high peak output drive current of 4A per channel and fast rise and fall times. -
Pinout
The UCC27201DR is a dual-channel gate driver with a pin count of 8. It is typically used to drive MOSFETs and IGBTs in power electronics applications. Pin functions include high and low-side gate drive outputs, bootstrap voltage supply, and ground and supply voltage connections. -
Manufacturer
The UCC27201DR is manufactured by Texas Instruments Incorporated, which is an American technology company that designs and manufactures semiconductor electronics. Texas Instruments is known for producing a wide range of integrated circuits, including analog and digital semiconductor technologies. -
Application Field
The UCC27201DR is primarily used in power management applications, such as low-side drivers for MOSFETs. Its dual-channel configuration and high output current capability make it suitable for various high-power systems, including motor drives, power supplies, inverters, and converters in industrial, automotive, and consumer electronics applications. -
Package
The UCC27201DR chip is in a Surface Mount Package (PowerPAD SOIC), it comes in the form of a reel, and the size is 8-SOIC (0.154", 3.90mm Width).
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