Pedidos acima de
$5000TMPN3150B1AF
Serial IO/Communication controller with a data rate of 1.25M bps
Marcas: Toshiba America Electronic Components
Parte do fabricante #: TMPN3150B1AF
Ficha de dados: TMPN3150B1AF Ficha de dados (PDF)
Pacote/Caso: QFP-64
Tipo de Produto: Application Specific Microcontrollers
Status RoHS:
Condição de estoque: 6.554 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
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TMPN3150B1AF Descrição geral
Toshiba's TMPN3150B1AF microprocessor is a standout product in the digital television space, offering a powerful ARM Cortex-A9 dual-core processor with speeds of up to 1.2 GHz. Its 1 MB of L2 cache memory provides an added boost to processing speed and efficiency, while the 40nm process technology strikes an ideal balance between power efficiency and performance. With support for interfaces such as HDMI, USB, Ethernet, and PCIe, as well as an integrated GPU for multimedia and graphics processing, the TMPN3150B1AF is well-suited for the demands of digital television applications. Moreover, its advanced security features ensure the protection of data and system integrity, making it a reliable and secure choice for digital TV systems
Características
- Enhanced accuracy and reliability
- Fast signal acquisition and tracking
- Multifrequency support for global coverage
Aplicativo
- Energy efficient
- Automotive solutions
- Smart home systems
Especificações
Parâmetro | Valor | Parâmetro | Valor |
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Source Content uid | TMPN3150B1AF | Rohs Code | No |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | TOSHIBA CORP |
Part Package Code | QFP | Package Description | QFP, QFP64,.66SQ,32 |
Pin Count | 64 | HTS Code | 8542.31.00.01 |
Address Bus Width | 16 | Boundary Scan | NO |
Clock Frequency-Max | 10 MHz | Data Transfer Rate-Max | 0.15625 MBps |
External Data Bus Width | 8 | JESD-30 Code | S-PQFP-G64 |
JESD-609 Code | e0 | Length | 14 mm |
Low Power Mode | NO | Number of Serial I/Os | 5 |
Number of Terminals | 64 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Package Body Material | PLASTIC/EPOXY |
Package Code | QFP | Package Equivalence Code | QFP64,.66SQ,32 |
Package Shape | SQUARE | Package Style | FLATPACK |
Qualification Status | Not Qualified | Seated Height-Max | 3.15 mm |
Supply Current-Max | 30 mA | Supply Voltage-Max | 5.5 V |
Supply Voltage-Min | 4.5 V | Supply Voltage-Nom | 5 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | GULL WING | Terminal Pitch | 0.8 mm |
Terminal Position | QUAD | Width | 14 mm |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias | |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
Transferência bancária | cobrar taxa bancária de US$ 30,00. | |
PayPal | cobrar taxa de serviço de 4,0%. | |
Cartão de crédito | cobrar taxa de serviço de 3,5%. | |
Western Union | charge US.00 banking fee. | |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
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Etapa1 :produtos
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Etapa2 :Embalagem a vácuo
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Etapa3 :Saco antiestático
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Etapa4 :Embalagem individual
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Etapa5 :Caixas de embalagem
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Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
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The TMPN3150B1AF chip is a microcontroller unit manufactured by Toshiba. It features a 32-bit ARM Cortex-M4F core and offers various advanced features such as multiple communication interfaces, analog functions, and memory options. This chip is commonly used in applications where low power consumption, high performance, and system integration are crucial, such as industrial automation, consumer electronics, and IoT devices.
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Features
The TMPN3150B1AF is a system-on-chip (SoC) designed for digital TV applications. It features a built-in H.265/HEVC video decoder, integrated audio decoder, customizable user interface, Ethernet connectivity, and support for various input/output interfaces. It offers high-quality multimedia playback and flexibility for different television applications. -
Pinout
The TMPN3150B1AF is a microcontroller with 128 pins. It performs various functions such as processing data, controlling peripherals, and executing instructions. -
Manufacturer
The manufacturer of the TMPN3150B1AF is Toshiba. Toshiba is a Japanese multinational conglomerate company that produces a wide range of products, including semiconductors, consumer electronics, and home appliances. They are known for their innovation and expertise in various industries. -
Application Field
The TMPN3150B1AF is a microcontroller specifically designed for automotive applications. It can be used in various areas such as engine control units, body control units, air conditioning systems, advanced driver-assistance systems (ADAS), and infotainment systems. -
Package
The TMPN3150B1AF chip has a package type of FBGA (Fine-Pitch Ball Grid Array), a form of surface mount packaging. It has a size of 19mm by 19mm, making it a relatively small chip in terms of dimensions.
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Temos produtos ricos que podem atender às suas diversas necessidades.
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A quantidade mínima de pedido começa em 1 unidade.
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A menor taxa de envio internacional começa em US$ 0,00
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365 dias de garantia de qualidade para todos os produtos