TI TMP275AIDR

Part points

• The TMP275AIDR is a digital temperature sensor chip developed by Texas Instruments. It offers high accuracy temperature measurements and can interface with digital systems through the I2C or SMBus interfaces. The chip has built-in nonvolatile memory for storing configuration settings, and it operates at low power, making it suitable for various applications requiring temperature sensing.

• Equivalent

  Some equivalent products of the TMP275AIDR chip include the TMP275A, TMP275B, and TMP275C chips, which are all digital temperature sensors with similar features and functionality.

• Features

  The TMP275AIDR is a digital temperature sensor offering high accuracy (±0.5°C), low power consumption, and a small form factor (SOT-23 package). It provides an I2C interface for easy communication with microcontrollers, and offers programmable temperature limits and hysteresis. The device also includes 16 programmable addresses, making it suitable for multi-node applications.

• Pinout

  The TMP275AIDR is a digital temperature sensor with a 6-pin package. It features an I2C interface for communication and has a temperature range of -40°C to +125°C. The pin functions include power supply (VDD and GND), serial data (SDA) and serial clock (SCL) for communication, and an ALERT pin for temperature threshold detection.

• Manufacturer

  The manufacturer of the TMP275AIDR is Texas Instruments. Texas Instruments is an American semiconductor company that designs and manufactures various electronic components, including integrated circuits and sensors.

• Application Field

  The TMP275AIDR is a high-accuracy, low-power digital temperature sensor that can be used in a variety of applications, including consumer electronics, industrial automation, automotive, and medical devices. It provides precise temperature measurement with a wide temperature range, making it suitable for a wide range of temperature monitoring and control purposes in different industries.

• Package

  The TMP275AIDR chip is available in a small outline package (SOIC), with a form factor of 8 pins. The dimensions of the package are typically 3.00mm x 4.90mm x 1.10mm.