Pedidos acima de
$5000TI TLV9002IDSGR
±2.75V/5.5V operating voltage range enables compatibility with various systems
![ISO14001](/img/about/iso14001.png)
![ISO9001](/img/about/iso9001.png)
![DUNS](/img/about/duns.png)
Marcas: TI
Parte do fabricante #: TLV9002IDSGR
Ficha de dados: TLV9002IDSGR Ficha de dados (PDF)
Pacote/Caso: WSON-8
Tipo de Produto: Instrumentation, OP Amps, Buffer Amps
Status RoHS:
Condição de estoque: 2.850 peças, novo original
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
TLV9002IDSGR Descrição geral
The TLV9002IDSGR amplifier is a versatile component that caters to a wide range of applications requiring low-voltage operation and high capacitive-load drive. With rail-to-rail input and output swing capabilities, this dual-channel op amp is part of the TLV900x family, offering cost-effective solutions for space-constrained devices like smoke detectors, wearable electronics, and small appliances. The TLV900x family is designed to handle capacitive loads of up to 500 pF, making it suitable for applications with high capacitive load requirements. These op amps are specifically engineered for low-voltage operation, with performance specifications that closely match the TLV600x devices
![TLV9002IDSGR TLV9002IDSGR](/files/uploads/product/b/20230301155830241.jpg)
Características
- CMOS tech
- Low offset
- Stable design
Especificações
Parâmetro | Valor | Parâmetro | Valor |
---|---|---|---|
Number of channels | 2 | Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) | 5.5 |
Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) | 1.8 | Rail-to-rail | In, Out |
GBW (typ) (MHz) | 1 | Slew rate (typ) (V/µs) | 2 |
Vos (offset voltage at 25°C) (max) (mV) | 1.5 | Iq per channel (typ) (mA) | 0.06 |
Vn at 1 kHz (typ) (nV√Hz) | 30 | Rating | Catalog |
Operating temperature range (°C) | -40 to 125 | Offset drift (typ) (µV/°C) | 0.6 |
Features | Cost Optimized, EMI Hardened, Shutdown, Small Size | CMRR (typ) (dB) | 90 |
Iout (typ) (A) | 0.04 | Architecture | CMOS |
Input common mode headroom (to negative supply) (typ) (V) | -0.1 | Input common mode headroom (to positive supply) (typ) (V) | 0.1 |
Output swing headroom (to negative supply) (typ) (V) | 0.01 |
Envio
Tipo de envio | Taxa de envio | Tempo de espera | |
---|---|---|---|
![]() |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 dias |
![]() |
FedEx | $20.00-$40.00 (0.50 KG) | 2-5 dias |
![]() |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
![]() |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 dias |
![]() |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 dias |
![]() |
CORREIO AÉREO REGISTADO | $20.00-$40.00 (0.50 KG) | 2-5 dias |
Tempo de processamento: A taxa de envio depende de diferentes zonas e países.
Pagamento
Termos de pagamento | Taxa de mão | |
---|---|---|
![]() |
Transferência bancária | cobrar taxa bancária de US$ 30,00. |
![]() |
PayPal | cobrar taxa de serviço de 4,0%. |
![]() |
Cartão de crédito | cobrar taxa de serviço de 3,5%. |
![]() |
Western Union | charge US.00 banking fee. |
![]() |
Grama de dinheiro | cobrar taxa bancária de US$ 0,00. |
Garantias
1.Os componentes eletrônicos que você compra incluem garantia de 365 dias, garantimos a qualidade do produto.
2. se alguns dos itens que você recebeu não forem de qualidade perfeita, providenciaremos seu reembolso ou substituição com responsabilidade. Mas os itens devem permanecer em sua condição original.
Embalagem
-
Etapa1 :produtos
-
Etapa2 :Embalagem a vácuo
-
Etapa3 :Saco antiestático
-
Etapa4 :Embalagem individual
-
Etapa5 :Caixas de embalagem
-
Etapa6 :etiqueta de envio com código de barras
Todos os produtos serão embalados em saco antiestático. Envio com proteção antiestática ESD.
Fora da etiqueta da embalagem ESD serão utilizadas as informações da nossa empresa: Número da peça, marca e quantidade.
Iremos inspecionar todas as mercadorias antes do envio, garantir que todos os produtos estejam em boas condições e garantir que as peças sejam novas folhas de dados originais.
Depois que todas as mercadorias forem garantidas sem problemas na pós-embalagem, embalaremos com segurança e enviaremos por expresso global. Apresenta excelente resistência a perfurações e rasgos, além de boa integridade de vedação.
Part points
-
The TLV9002IDSGR is a dual operational amplifier chip from Texas Instruments. It is known for its high precision and low power consumption, making it suitable for applications in battery-powered devices, sensor interfaces, and signal conditioning circuits. The chip is designed with rail-to-rail input and output for improved performance in low-voltage environments.
-
Equivalent
Some equivalent products of TLV9002IDSGR chip are AD8226, LTC1052, MCP6002, MAX4194, and OPA2333. These chips are dual operational amplifiers with similar specifications and features. -
Features
The TLV9002IDSGR is a dual-channel comparator with push-pull output that operates from a single supply voltage as low as 2.7V. It has a fast response time, low power consumption, and a wide input voltage range. The device is available in a small VSSOP-8 package. -
Pinout
TLV9002IDSGR is a dual-channel operational amplifier with a 10-pin VSSOP package. It has two input pins (IN-) and (IN+), two output pins (OUT1, OUT2), power supply pins (V+, V-), and ground pins (GND). The TLV9002IDSGR is commonly used in audio signal conditioning, active filters, and sensor interfaces. -
Manufacturer
The TLV9002IDSGR is manufactured by Texas Instruments (TI). Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies. They produce a wide range of integrated circuits and semiconductor products used in various applications, including industrial, automotive, consumer electronics, and communications. -
Application Field
TLV9002IDSGR is a dual-channel, precision operational amplifier with low power consumption, suitable for applications in industrial automation, sensor signal conditioning, portable medical devices, and battery-powered equipment. It is designed for use in instrumentation amplifiers, data acquisition systems, and precision voltage references due to its low input bias current and high open-loop gain. -
Package
The TLV9002IDSGR chip comes in a package type called "VSSOP." It has a "DS" form, indicating a dual-supply voltage configuration. Its size is typically around 3mm x 3mm, offering a compact footprint for integration into various electronic applications.
Oferecemos produtos de alta qualidade, serviço atencioso e garantia pós-venda
-
Temos produtos ricos que podem atender às suas diversas necessidades.
-
A quantidade mínima de pedido começa em 1 unidade.
-
A menor taxa de envio internacional começa em US$ 0,00
-
365 dias de garantia de qualidade para todos os produtos