TLP627-4(F)

Part points

• The TLP627-4(F) is an integrated circuit chip designed for driving a phototransistor. It consists of an infrared LED optically coupled to a phototransistor. The input side receives electrical signals and converts them into light signals, which are then detected and amplified by the phototransistor on the output side. The chip ensures efficient signal transmission and isolation between the input and output sides.

• Equivalent

  There are several equivalent products to the TLP627-4(F) chip, including PS2505-1, H11L1, PC900V, and PC357N1T. These chips all belong to the same optoisolator family and provide similar functionality, making them suitable replacements for the TLP627-4(F).

• Features

  The TLP627-4(F) is a photocoupler featuring high isolation voltage, high-speed response, and low input current. It is suitable for applications such as power supply control, digital logic ground isolation, and microprocessor system interface. The device also provides guaranteed performance over a wide temperature range and is available in a compact and surface-mountable package.

• Pinout

  The TLP627-4(F) is a 16-pin optocoupler device. It consists of a GaAs infrared emitting diode and a photo transistor. The pins include VCC, GND, input photodiode, and output photo transistor. It is primarily used for isolating low voltage digital signals in electronic circuits.

• Manufacturer

  The TLP627-4(F) is manufactured by Toshiba. Toshiba Corporation is a multinational conglomerate company based in Japan, specializing in various fields such as electronics, electrical equipment, and social infrastructure systems. It produces a wide range of products, including semiconductors, household appliances, medical equipment, and more.

• Application Field

  The TLP627-4(F) is a photocoupler optoisolator chip designed for isolation and switching applications. It is commonly used in various areas including industrial automation, power supply control, motor control, and communication equipment. It provides electrical isolation between input and output, helping to protect sensitive electronic components from high voltage or current spikes.

• Package

  The TLP627-4(F) chip is available in a DIP (Dual Inline Package) form. The package size is 16-pin and its dimensions are approximately 19.30mm x 6.70mm x 8.20mm.